Artificial intelligence AI has become one of the most significant drivers of semiconductor innovation in history. While AI applications often receive the most attention, the underlying hardware infrastructure that enables AI consists of a highly sophisticated ecosystem of semiconductor technologies. Modern AI data centers… Read More
DAC 2026: The Trouble with John Cooley’s Troublemaker PanelFor quite a few years, John Cooley has…Read More
The Difference Between TSMC CoWoS-S and CoWoS-RCoWoS-S and CoWoS-R are two versions of TSMC’s…Read More
Industry's First Certified Automotive Grade PUF for Software Defined VehiclesSoftware defined vehicles (SDVs) are transforming the automotive…Read More
Formal Acceleration on FPGA. Innovation in VerificationExtending hardware acceleration to formal verification is a…Read More
Previewing FMS 2026: The Next Frontier of Enterprise Memory, CXL, and AI-Era StorageFor anyone tracking enterprise infrastructure, the storage landscape…Read MoreMach42 Delivers a Different Take on AI in the Design Flow at DAC 2026
I believe DAC 2026 will be remembered as the turning point for AI assisted design. There has been discussion about AI infusion in EDA for a while now. Most of it was about how AI can be added to traditional tools to make existing methodologies better. This year, that changed. There were several new companies that highlighted a fundamentally… Read More
The AI Genie Is Out of the Bottle and Won’t Go Back
This week, Meta became the fourth major AI lab in two weeks to disclose that one of its own models breached another company’s systems during a security test. The company says a misconfiguration by an outside evaluator handed its Muse Spark 1.1 model internet access it wasn’t supposed to have — an accident in the test … Read More
McClean Report June 2026: Q2 Semiconductor Market Forecast Update
The semiconductor industry is entering an extraordinary growth phase, driven primarily by artificial intelligence infrastructure and the severe supply constraints surrounding advanced logic and memory devices. According to the McClean Report’s June 2026 update, the global semiconductor market is forecast to grow 98.3%… Read More
Imec Unlocks System-Level III-V Chiplet Integration on Si-CMOS with Advanced 300mm RF Silicon Interposer Platform
As wireless communication systems evolve toward 6G, satellite connectivity, advanced radar, and high-performance sensing applications, the integration of heterogeneous semiconductor technologies has become a critical challenge. Silicon CMOS remains the dominant platform for digital processing and system control,… Read More
DAC 2026: Accellera Luncheon Panel on Embracing AI for Advanced Design and Verification
AI was a hot topic at DAC this year. If you attended the event, you’ve already heard about many new tools and systems that aim to improve time to market and quality for advanced semiconductors and systems. I had the pleasure of chairing an Accellera sponsored luncheon panel on Tuesday at DAC that took a different view of AI.
As AI and … Read More
Shift Left with S2C Prodigy: From RTL Verification to Real-World Software Validation
For modern SoC teams, “shift left” no longer means finding a few more RTL bugs before tape-out. It means moving meaningful system validation earlier—far enough left that firmware, operating systems, drivers, applications, and external interfaces can be exercised before first silicon arrives. This change is essential as software… Read More
How SOCAMM2 Could Reshape Server Memory for AI
As artificial intelligence systems become larger and more demanding, memory is becoming one of the most important constraints in server design. Modern AI workloads do not only require powerful GPUs and accelerators; they also require enormous amounts of data to move quickly and efficiently between memory and compute engines.… Read More
Executive Interview with James Huang of AlChip
I had a chance sit down with James Huang, Director of Engineering at Alchip Technologies, to discuss the company’s recent multi-die packaging achievements and learn about Alchip’s next steps in pushing the boundaries of innovation for next generation AI ASIC.
James is acknowledged as a leading light in advanced node ASICs, based… Read More
Synopsys Demonstrates Leadership in AI-Powered Engineering at 2026 DAC Chips to Systems Conference
Purple was in fashion at the 2026 Design Automation Conference, where Synopsys reinforced its position at the forefront of AI-powered engineering. Under the conference’s “Chips to Systems” theme, the company showcased intelligent, end-to-end technologies designed to help the semiconductor industry manage unprecedented… Read More


ASML High-NA EUV is Not Ready for High-Volume Production