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CEO Interview with Timothy Regan of IN2FABTimothy Regan has substantial experience in analog/ mixed…Read More
The $9.5 Billion Design IP Market: Shifting Boundaries, Arm's Monopoly, and the RISC-V ResponseWhile semiconductor design intellectual property (IP) is a…Read More
Technical Case Study: MicroLED Yield Management with Plessey and yieldWerxPlessey Semiconductors manufactures monolithic MicroLED displays for near-eye…Read More
Unified Emulation and Prototyping: Pipedream or Reality?Preamble Hardware-assisted verification (HAV) platforms, including hardware emulators…Read More
OpenAI’s Jalapeño is a custom accelerator designed specifically for AI inference, particularly the low-latency, multi-chip workloads behind interactive and agentic systems. Its central idea is that useful performance cannot be reduced to peak floating-point operations or memory bandwidth. What matters is how quickly … Read More
On the last day of #DAC2026 I stopped by the Keysight booth to chat with Nilesh Kamdar, GM of EDA Business to get an update. He has spent 27 years in the industry, and this made 25 DAC trips for him. For Keysight the application areas of focus are serving designers of high frequency and high-speed digital, RF, and mm/uwave designs. An … Read More
The 2026 Ceva Edge Symposium will bring together engineers, technology leaders, ecosystem partners, and innovators to explore a major shift in computing: moving artificial intelligence from distant cloud infrastructure into the devices that interact directly with the physical world. Scheduled for November 2 in Hsinchu,… Read More
Samsung’s Hot Chips 2026 presentation, “HBM Base Die: How HBM Will Evolve Using Advanced Logic Processes,” argues that the base die beneath a High Bandwidth Memory stack is about to become far more than a communications layer. Traditionally, an HBM base die mainly connects stacked DRAM dies to a GPU, TPU, or other processor and … Read More
Source: Jonathon Evans and Polychronis Xekalakis, “NVIDIA Vera CPU,” Hot Chips 2026. Performance figures are NVIDIA claims, and several results were based on preproduction or unofficial testing.
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As vehicles evolve into software-defined, increasingly autonomous platforms, video processing is becoming part of the safety-critical computing chain. Camera feeds support functions ranging from surround-view monitoring and driver assistance to object detection and automated driving. If the hardware processing those… Read More
Intel Foundry and ASML say high-numerical-aperture extreme-ultraviolet lithography has crossed an important boundary: it is no longer only a development tool, but a production technology. At the SPIE Photomask Technology and Extreme Ultraviolet Lithography conference, the companies reported that Intel has processed … Read More
ASML and TSMC’s proposed shift from 6-inch to 12-inch photomasks is an attempt to redesign a critical but often overlooked part of advanced semiconductor manufacturing. Photomasks are precision plates carrying the circuit patterns projected by a lithography scanner onto a silicon wafer. In extreme-ultraviolet lithography,… Read More
On Tuesday at #DAC2026 I attended the exhibitor presentation, Synopsys: How Silicon Startups are Addressing the AI Memory Gap. Vikram Bhatia from Synopsys introduced the two presentations from Wenbo Yin, SVP of IC Design at TetraMem and R. Scott Hills, VP of Business Development at ANAFLASH. Datacenters consume large amounts… Read More
AI can compress the path to tape-out. The next challenge is compressing physical realization.
Something important is beginning to happen in semiconductor development: the design cycle itself is becoming compressible.
AI-assisted engineering can accelerate architecture exploration, RTL development, verification, physical… Read More
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Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry