Charlie Cheng is CEO of TeRAM, with four decades of technology experience focused on microprocessor architecture and semiconductor memory. Before TeRAM, he worked on several AI processors, including multiple generations of Meta’s MTIA accelerators beginning in 2019. Previously, he served as CEO of Kilopass, a semiconductor… Read More
TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of ChipsIt’s that time of year again. Time certainly…Read More
PDF Solutions CONNECT 2026: Where Semiconductor Data Meets AIThe semiconductor industry is entering a period in…Read More
Webinar – ChipAgents Shows You How to Break the Timing Closure Bottleneck with AIWe all know timing closure is one of…Read More
Jalapeño Hot Chip, Cool Power Bill: OpenAI Turns Up the Heat on AI InferenceOpenAI’s Jalapeño is a custom accelerator designed specifically…Read MoreThe Invisible Bottleneck Is Costing You Time You Can’t Get Back
By Joel Jorgensen, FlowAccel.
The 2026 Siemens EDA and Wilson Research Group study just came out. Verification now eats close to half the schedule on every IC and FPGA program. I don’t doubt that number. What I don’t know is how much of it is actually verification, and how much of it is something else showing up disguised… Read More
ASML Has High-NA and Chipmakers Can’t Say No
ASML’s grip on the most advanced corner of chip manufacturing is tightening. The Dutch company, already the sole supplier of extreme ultraviolet lithography systems, is winning broader industry support for High Numerical Aperture EUV, or High NA, its next-generation technology for printing smaller and denser circuitry.… Read More
Podcast EP366: How Cognichip is Changing Chip Design with Faraj Aalaei
Daniel is joined by the CEO of Cognichip, Faraj Aalaei, a successful visionary entrepreneur with over 40 years of distinguished experience in communications and networking technologies. As a leading entrepreneur in Silicon Valley, he was responsible for building and leading two semiconductor companies through IPOs as a founder… Read More
Arm targets the agentic AI era with new edge, cloud and robotics platforms
Arm is expanding its computing platform for an era in which artificial intelligence does more than respond to individual prompts. The company expects AI agents to operate continuously across phones, data centers, vehicles, robots and other physical systems—perceiving their surroundings, reasoning about objectives and … Read More
Rethinking AI Chips: How VSORA Redesigned the Hardware That Runs AI
Instead of tweaking existing designs, VSORA built an AI chip from scratch to fix the real bottleneck: moving data fast enough to keep the math circuits busy.
There’s a version of the AI hardware story that everyone in the chip industry has heard a hundred times. A startup raises money on a clever chip design, promises to topple… Read More
A Study of Photoresist Bake Influence on Stochastics for DUV Immersion Lithography
Deep-ultraviolet (DUV) immersion lithography remains a critical patterning technology for advanced semiconductor manufacturing. Using a 193 nm ArF exposure system with water between the projection lens and wafer, immersion lithography increases numerical aperture and enables smaller features than dry exposure. However,… Read More
UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips
Ceva and LG Electronics have joined forces to remove one of the biggest obstacles to ultra-wideband adoption: integrating a complete radio, baseband and software stack into a production system-on-chip. Their joint platform combines Ceva-Waves UWB baseband intellectual property and software with an RF front end developed… Read More
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity
By Tim Messegee, Senior Director of Solutions Marketing at Rambus
PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs… Read More
CAST Moves the Full TCP/IP Stack into Hardware at 100 Gbps
CAST has introduced TCPIP-100G, a synthesizable intellectual-property core that implements a complete TCP/IP stack in hardware for ASICs and FPGAs. The core is designed to transmit and receive at up to 100 Gbps without depending on a host processor. That distinction is important: this is not simply a checksum engine or a network-interface… Read More


DAC 2026: The Trouble with John Cooley’s Troublemaker Panel