CEO Interview with Sunghyun Park of RebellionsDr. Sunghyun Park earned his B.S. from KAIST…Read More
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As chipmakers put more computing power into a single system, the challenge extends beyond making individual chips faster. They must connect multiple chips, memory stacks, power supplies, and sometimes optical components in a compact package. In the2026 TSMC OIP Forum talk “Addressing Inter-Die Complexity for 3D Multi-Die… Read More
Recently, I had the opportunity to speak with Johann Foucher, founder and CEO of Pollen Metrology, a French company whose journey offers a rare vantage point on how artificial intelligence is reshaping semiconductor manufacturing from the inside out. What makes Pollen Metrology’s story compelling isn’t just … Read More
Next-gen AI accelerators, high-performance processors, and complex computing architectures depend heavily on advanced packaging. Bringing multiple dies, chiplets, high-bandwidth memory, and advanced interconnects together into a single 2.5D or 3D package yields massive performance gains. However, this design evolution… Read More
Siemens and TSMC are expanding their collaboration on semiconductor design tools, with a focus on AI assisted workflows, advanced chip packaging and support for newer manufacturing processes. Their announcement centers on an AI agent intended to find and fix design rule violations: errors that can prevent a chip layout from… Read More
Agentic AI is beginning to move semiconductor engineering beyond copilots and isolated task automation.
From Agentrys’ public material and recent discussion, its architecture points toward a broader engineering flow:
Specification → RTL → verification → synthesis / physical design → PPA optimization → physical verification… Read More
The 2026 TSMC Open Innovation Platform (OIP) Ecosystem Forum was held on September 23, 2026, in Santa Clara, CA. This is the event where TSMC showcases the substantial progress made with its massive semiconductor ecosystem. As one would expect, AI was a key topic throughout the day, with some very impressive results reported and… Read More
By Piyush Bag
Intro: In this AI era, building data centers has become crucial not just for hyperscalers, but for many companies as well, as they build the infrastructure for AI. At a high level, a data center includes compute, storage, networking, and other infrastructure. This article is about the design lifecycle of network hardware.… Read More
Synopsys today announced its AgentEngineerTM solutions portfolio and AutopilotTM Platform, advancing a fundamental paradigm shift in electronic design automation (EDA): moving beyond AI copilots toward autonomous engineering agents. Following a recent technical briefing with Thomas Andersen, Vice President of AI and… Read More
On October 15 and 16, 2026, in San Francisco, PDF Solutions will hold PDF Solutions CONNECT, the premier event for Semiconductor Analytics and AI. This event starts at the end of SEMICON WEST 2026 in a location in close proximity to the Moscone Center. It is a great opportunity for leading semiconductor and equipment companies attending… Read More
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