One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published more than 150 blogs… Read More
TSMC OIP Ecosystem Forum 2026: Spotlight on Emerging Technologies The TSMC OIP Ecosystem Forum highlighted many…Read More
Intel Foundry: AI performance now depends on the whole systemFor decades, chipmakers improved computing performance largely by…Read More
TSMC’s AI Design Kit: Bringing Agentic AI Into Chip DesignTSMC is introducing an AI Design Kit, or…Read More
OpenAI and Synopsys Announce GPT-Synopsys: Why AI-Powered Chip Design MattersWow, OpenAI and Synopsys just announced a multiyear…Read MoreBuilt to Deliver the Answer, Not to Train the Model
How VSORA rebalances memory and compute for AI inference in the data center and at the edge
For more than a decade, the AI hardware industry focused mainly on model training, while inference represented a smaller share of overall demand. That balance is changing as trained models are deployed widely in recommendation engines, … Read More
From Faster Proofs to Trusted Silicon with LUBIS EDA
LUBIS EDA is introducing FormalOS, a platform designed to make formal verification more systematic, scalable and predictable. Built on the company’s five-stage methodology, it combines structured workflows, verification playbooks, automation, reusable verification assets and sign-off evidence within customers’ existing… Read More
Podcast EP371: How Vinci is Revolutionizing Hardware Design with John Bruggeman
Daniel is joined by John Bruggeman, Chief Marketing Officer at Vinci, where he leads the company’s market narrative and strategic positioning. His work focuses on translating complex technical advances into clear category definition, industry relevance, and market adoption.
Daniel discusses How Vinci fits into the hardware… Read More
Siemens CTO update on Calibre at DAC 2026
At DAC 2026 I had the opportunity to speak with Juan Rey, CTO Siemens EDA about the Calibre product used for IC physical verification, circuit verification, 3D IC and DFM optimization. Juan has been involved with Calibre since 2001, served on the Board of Directors of Silicon Integration Initiative (SI2), on the Executive Technology… Read More
From Simulation to Deployment: Why Physical AI Matters
Artificial intelligence is moving beyond the screen. The attached presentation describes a shift from systems that generate text, images, and code to systems that can perceive their surroundings and take action. These systems could guide robots, vehicles, factory equipment, medical devices, and critical infrastructure.… Read More
Significant Performance Gains Reinforce Imagination’s GPU-First Strategy
Imagination Technologies’ first performance figures for its E-Series GPU IP turn its “GPU-first” strategy from an architectural proposition into a measurable product claim. The company is arguing that edge systems do not need separate, lightly utilised blocks for graphics, general compute and artificial intelligence. … Read More
2026 AI Agent Breaches
It has been a busy year for sure. In 2026, artificial intelligence agents conducting cybersecurity tests crossed into real computer systems. The incidents had different causes and impacts. Some agents exploited flaws to escape isolation; others had unintended internet access and mistook real organizations for simulated … Read More
CEO Interview with Paul Butler of VeriQuantix
Paul is an experienced CEO/General Manager/Investment Manager who has led and developed teams in a technology domain across the communications, medical and mining industries. With qualifications in Electrical Engineering and a Bachelor of Economics Paul has been able to develop and bring new products to global markets.
Tell… Read More
AI-EDA Agents Can Prove Their Value
Before EDA becomes AI-native, focused agents have a window to prove measurable engineering value inside existing design flows.
AI is entering semiconductor engineering from several directions at once.
Some companies are building broad agentic design environments. Others are attacking specific bottlenecks: timing closure,… Read More



Intel Foundry: AI performance now depends on the whole system