Analog Bits Targets the Power Challenge at the Heart of Next-Generation ChipsAnalog Bits is expanding its role in advanced…Read More
Broadcom’s AI Engine Shifts Into OverdriveBroadcom’s fiscal third-quarter 2026 results show how artificial-intelligence…Read More
TSMC’s CoWoS Capacity to Double by 2028—and Rivals Will Still Win OrdersTSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity…Read More
👉 This is Part 2 of an editorial series on the evolving economics of AI inference. If you missed Part 1, where I broke down the shift toward full-system integration, the lessons from the AI Infra Summit, and the “no forks” open-source philosophy, you can read it HERE: Beyond the Accelerator: Why Silicon Challengers … Read More
Modern system-on-chip (SoC) and application-specific integrated circuit (ASIC) designs are extraordinarily complex. They may combine processors, accelerators, memory controllers, high-speed interfaces, security functions, and millions—or even billions—of logic gates. Verifying these systems entirely through … Read More
The central argument of Ankur Gupta’s AI Infra Summit keynote is simple but consequential: the next leap in AI infrastructure will not come from improving chips, servers, cooling systems, or data centers independently. It will come from optimizing the connections among them. Siemens frames this as a journey “from custom silicon… Read More
When I interviewed with Silicon Creations 15 years ago, I met directly with the company’s two founders, Jeff Galloway and Randy Caplan. I joined in 2011 as a circuit designer, and the three of us were the entire company. Today, Silicon Creations has grown to nearly 200 employees across multiple locations and serves almost 600 customers… Read More
At the 2026 OIP Ecosystem Forum, the industry narrative shifted from incremental scaling to what TSMC defines as the “Intelligence Revolution.” Akin to the 18th-century Industrial Revolution which transitioned human physical labor to mechanical power, the current era is augmenting human ingenuity through … Read More
Daniel is joined by Aveek Sarkar, who heads TSMC’s Ecosystem and Alliance Management Division. Along with his team, he is responsible for driving semiconductor design enablement in collaboration with the partner ecosystem through TSMC’s Open Innovation Platform® (OIP). Prior to TSMC, Aveek worked on chip designs at Sun Microsystems… Read More
By Julie Rogers, Executive Director, Electronic System Design Alliance
2026 is “Bridging Design and Manufacturing with AI” during a day-long session Tuesday, October 13, from 10:30 a.m. to 4:30 p.m. at San Francisco’s Moscone Center, North Hall, Lower Level, Room 20.
The Design Session hosted and organized by the Electronic… Read More
One Year Later — September 2026
When this piece first ran a year ago, VSORA was the quiet outsider, a company with a bold architecture and no Silicon Valley address. One year on, the thesis has held up better than even its author expected. In January 2026, Sandra Rivera, former CEO of Altera and, before that, a two-decade Intel veteran… Read More
ASML is exploring how to produce more than 110 extreme ultraviolet lithography machines in 2028, reflecting the extraordinary investment flowing into artificial intelligence infrastructure. The Dutch semiconductor-equipment company expects to manufacture at least 80 EUV systems in 2027 and is considering another production… Read More
The recent AI Infra Summit was exceptionally jam-packed, filled to the brim with compelling talks, overlapping tracks, and emerging technologies. Amid the noise of the event, there were many excellent presentations detailing the physical realities of scaling hardware. But one presentation in particular caught my attention… Read More
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