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Semiconductor Expert Forum

Podcast EP12: A Close Look at Intel with Stacy Rasgon

Podcast EP12: A Close Look at Intel with Stacy Rasgon
by Daniel Nenni on 03-19-2021 at 10:00 am
Categories: Foundries, Intel Foundry
10 Comments

Dan takes an in-depth look at Intel with Stacy Rasgon, Managing Director and Senior Analyst, U.S. Semiconductors at Bernstein Research. Stacy is an unusual  semiconductor analyst as he holds a Ph.D. in chemical engineering from MIT. His substantial technical knowledge allows for a deep dive on Intel that you will find refreshing… Read More

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Electronics Back Strongly in 2021

Electronics Back Strongly in 2021
by Bill Jewell on 03-19-2021 at 8:00 am
Categories: China, Semiconductor Intelligence, Semiconductor Services

Electronics Production 2021

Electronics production has recovered strongly from slowdowns due to the COVID-19 pandemic. Most major Asian electronic producers reported double-digit increases in early 2021. The chart below shows three-month-average change versus a year ago for electronics production. The data is from each country’s official statistics… Read More

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Executive Interview: Casper van Oosten of Intermolecular, Inc.

Executive Interview: Casper van Oosten of Intermolecular, Inc.
by Daniel Nenni on 03-19-2021 at 6:00 am
Categories: CEO Interviews, EMD Electronics, Intermolecular, Semiconductor Services

Casper Van Oosten cut out 1

Casper van Oosten is the Business Field Head and Managing Director for Intermolecular, Inc., acquired by Merck KGaA, Darmstadt, Germany in 2019. Prior to this role, Casper worked in various roles on Eyrise™ Dynamic Liquid Crystal Window in Veldhoven, the Netherlands, at an affiliate of Merck KGaA, Darmstadt, Germany. Casper… Read More

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IP and Software Speeds up TWS Earbud SoC Development

IP and Software Speeds up TWS Earbud SoC Development
by Tom Simon on 03-18-2021 at 10:00 am
Categories: AI, Ceva, IP

CEVA Bluebud TWS Platform

The global market for earphones and headphones in 2020 is estimated to have been $34B and is expanding at a compound rate of over 20% per year. Of this almost 50% is said to be earphones which are shifting rapidly to True Wireless Stereo (TWS). We have seen the sales of TWS devices grow from 1M units is 2016 to 109M units in 2019, though … Read More

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Resistive RAM (ReRAM) Computing-in-Memory IP Macro for Machine Learning

Resistive RAM (ReRAM) Computing-in-Memory IP Macro for Machine Learning
by Tom Dillinger on 03-18-2021 at 6:00 am
Categories: Events, Foundries, TSMC

testsite

The term von Neumann bottleneck is used to denote the issue with the efficiency of the architecture that separates computational resources from data memory.   The transfer of data from memory to the CPU contributes substantially to the latency, and dissipates a significant percentage of the overall energy associated with … Read More

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SPIE 2021 – ASML DUV and EUV Updates

SPIE 2021 – ASML DUV and EUV Updates
by Scotten Jones on 03-17-2021 at 10:00 am
Categories: Events, Lithography

SPIE DUV 2021 ASML NXT4 DryWet Presentation final noWPD2 Page 42

At the SPIE Advanced Lithography Conference held in February, ASML presented the latest information on their Deep Ultraviolet (DUV) and Extreme Ultraviolet (EUV) exposure systems. I recently got to interview Mike Lercel of ASML to discuss the presentations.

DUV

Despite all the attention EUV is getting, most layers are still… Read More

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Quantum Tunneling for OTPs, PUFs: Higher security

Quantum Tunneling for OTPs, PUFs: Higher security
by Bernard Murphy on 03-17-2021 at 6:00 am
Categories: eMemory, IP
2 Comments

ememory neofuse min

I’ve had a number of enjoyable discussions with John East who ran Actel until it was acquired. (John and Actel devices also play an important role in my book, The Tell-Tale Entrepreneur.) This is relevant because Actel were well-known for their anti-fuse FPGAs. eMemory Technology, the subject of this blog, also produce an anti-fuse… Read More

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Delivering True Wireless Stereo (TWS) Experience

Delivering True Wireless Stereo (TWS) Experience
by Kalar Rajendiran on 03-16-2021 at 10:00 am
Categories: Dolphin Design, IP

Cropped Picture Purchase Criteria when choosing wireless headphones or earbuds

A recent blog about the Hearables market covered how expansive and far reaching the product opportunities promise to be. Of course, consumer purchase criteria will drive the product realizations, adoptions and consequently the market success of each of these envisioned products.­ Whether it is the earbud product or one of those… Read More

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Electromagnetic and Circuit RLCK Extraction and Simulation for Advanced Silicon, Interposers and Package Designs

Electromagnetic and Circuit RLCK Extraction and Simulation for Advanced Silicon, Interposers and Package Designs
by Tom Dillinger on 03-16-2021 at 6:00 am
Categories: Ansys, Inc., EDA

spiral complex

For years, there have been rather distinct domains for the extraction of interconnect models from physical design data.

Chip designers commonly focused on RC parasitics for circuit/path delay calculations and dynamic I*R voltage drop analysis.  The annotation of extracted parasitics to a netlist model required the layout… Read More

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Enabling Edge AI Vision with RISC-V and a Silicon Platform

Enabling Edge AI Vision with RISC-V and a Silicon Platform
by Tom Simon on 03-15-2021 at 10:00 am
Categories: AI, Automotive, IP, OpenFive, RISC-V, Semiconductor Services, SiFive

AI Chipset Market

AI vision processing moving to the edge is an undeniable industry trend. OpenFive, the custom silicon business unit of SiFive, discusses this trend with compelling facts in their recent paper titled “Enabling AI Vision at the Edge.” AI vision is being deployed in many applications, such as autonomous vehicles, smart cities, … Read More