With the TSMC Technical Symposium coming next month there is quite a bit of excitement inside the fabless semiconductor ecosystem. Not only will TSMC give an update on N3, we should also hear details of the upcoming N2 process.
Hopefully TSMC will again share the number of tape-outs confirmed for their latest process node. Given… Read More
Are 112G PAM4 channels in one of your current or future designs? If you’re focusing on advanced products, the answer is likely YES. Design of these channels is quite challenging. Silicon design, SerDes, PCB traces, and interconnect all need to be balanced to achieve success. As they say, getting there is half the fun. An upcoming… Read More
Dan is joined by Dr. Anthony J. Yu, vice president of the Computing and Wired Infrastructure (CWI) Business Unit at GlobalFoundries (GF), where he is responsible for providing differentiated photonic manufacturing services and solutions to clients across multiple industries. Prior to being named VP of CWI, Dr. Yu was vice… Read More
In the SoC world, we can’t believe our good luck. Every product maker now wants bespoke silicon solutions with the most advanced AI, communications, SLAM, etc. Which is fantastic for business, but this level of demand also drags us into a new level of accountability, especially in requirements traceability. Time was that only … Read More
I learned about Kandou a year ago and liked what I heard, as should anyone who wants higher res displays and faster downloads from their electronic devices. I’ve been tracking Kandou since and believe it’s living up to its goal to be the undisputed innovator in high-speed, energy-efficient chip-to-chip link solutions to improve… Read More
The tremendous increase in global data traffic over the past decade shows no sign of abating. Indeed, the applications for all facets of data communications are expanding, from 5G (and soon, 6G) wireless communications to metropolitan area networks serving autonomous vehicles to broader deployment of machine learning algorithms. … Read More
Every week in the technology trade press I am reading about cybersecurity attacks against web sites, apps, IoT devices, vehicles and even ICs. At the recent IP SoC Silicon Valley 2022 event in April I watched a cybersecurity presentation from Robert Rand, Solution Architect for Tessent Embedded Analytics at Siemens EDA. Common… Read More
A few months ago, I wrote about Corigine and their MimicPro FPGA prototyping system and MimicTurbo GT card solutions. That article went into the various features and benefits of the two solutions, with the requirements for next-generation prototyping solutions as the backdrop. You can access that article here. At 250+ employees,… Read More
Ever since the emergence of Uber and DiDi and Gett and Yandex and all the rest of the app-based ride hailing operators I have been worried about taxis. I had a sneaking suspicion that the ride hail operators were exploiting a loophole that put taxis at a disadvantage creating a mortal threat.
My suspicions were borne out by taxi driver… Read More
Dan is joined by Ken Potts, Alphacore’s Chief Operating Officer. Ken has over 30 years of successful entrepreneurship in both Fortune 100 as well as emerging technology companies. Ken has held numerous executive and operational leadership roles in semiconductor products, semiconductor IP, and electronic design automation.… Read More
AI RTL Generation versus AI RTL Verification