Revolutionizing Simulation Turnaround: How Siemens’ SmartCompile Transforms SoC VerificationIn the race to deliver ever-larger SoCs under…Read More
Arteris Simplifies Design Reuse with Magillem PackagingMany know Arteris as the “network-on-chip”, or NoC,…Read More
Hardware Verification is a highly data-intensive or data-heavy problem. Verification Engineers recognise this and spend much of their time dealing with large and complex datasets arising from verification processes.
In “The Dilemmas of Hardware Verification” we explored the key challenges … Read More
Samtec is well-known for its innovative signal channel solutions. Whether the application requires copper or fiber, Samtec can deliver incredible performance and flexibility. The quality of the company’s models, eval kits and design support are well-known. There is another aspect of Samtec’s innovation. I touched on it in… Read More
Over the last few years, transformers have been fundamentally changing the nature of deep learning models, revolutionizing the field of artificial intelligence. Transformers introduce an attention mechanism that allows models to weigh the importance of different elements in an input sequence. Unlike traditional deep learning… Read More
With the increasing on-chip integration capabilities, large scale electronic systems can be integrated into a single System-on-Chip or SoC. New manufacturing test challenges are raised for more advanced technology nodes where both quality and cost during testing are affected. A typical parameter is test coverage which impacts… Read More
In our interconnected world, systems ranging from smart cities and autonomous vehicles to industrial control systems and healthcare devices have become everyday components of our lives. This fusion of physical and digital systems has led to a term called cyber-physical system (CPS). Ubiquitous connectivity is exposing the… Read More
China’s recent achievement of a 7nm-class foundry node using only DUV lithography [1] raises the question of how far DUV lithography can be extended by multipatterning. A recent publication at CSTIC 2023 indicates that Chinese groups are currently looking at extension of DUV-based multipatterning to 5nm, going so far… Read More
The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More
Dan is joined by Dr. Victor Moroz, a Synopsys Fellow engaged in a variety of projects on leading edge modeling Design-Technology Co-Optimization. He has published more than 100 technical papers and over 300 US and international patents. Victor has been involved in many technical committees and is currently serving as an Editor… Read More
Stephen Rothrock founded ATREG in 2000 to help global advanced technology companies divest and acquire infrastructure-rich manufacturing assets. Over the last 25 years, his firm has completed more than 100 transactions, representing over 40% of all global operational wafer fab sales in the semiconductor industry for operational,… Read More
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