Dan is joined by Mike Eftimakis. Mike has an extensive background in the electronics industry with almost 30 years in senior technical and business roles. After innovating with companies like VLSI, NewLogic or Arm, he is now VP Strategy and Ecosystem at Codasip, where he drives the long-term vision and its day-to-day implementation.… Read More
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.
How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?
With… Read More
With our continuing chiplet coverage I found this of great interest. I have always felt that eFPGAs and chiplets are a natural fit for the next generation of chip design and this is an excellent example. As we design with chiplets one of the challenges is verification/validation in regards to performance and interoperability. … Read More
According to some AI dreamers, we’re almost there. We’ll no longer need hardware or software design experts—just someone to input basic requirements from which fully realized system technologies will drop out the other end. Expert opinions in the industry are enthusiastic but less hyperbolic. Bob O’Donnell, president, founder… Read More
The global semiconductor market dropped 8.7% in 1st quarter 2023 versus 4th quarter 2022, according to WSTS. This was the steepest quarter-to-quarter decline since a 14.7% drop in 1Q 2019. 1Q 2023 was down 21.3% from a year earlier, the largest year-to-year decline in thirteen years since a 30.4% drop in 1Q 2009. Revenues of the … Read More
Dan is joined by Hal Conklin, Vice President of Business Development for Lightelligence. Hal is an experienced strategic leader in the technology industry. Prior to joining Lightelligence, he spent 10 years at Arm and he also worked in executive management roles at several start-ups.
Hal provides details of a new and ground-breaking… Read More
The SPIE Advanced Lithography Conference was held in February. I recently had the opportunity to interview Steven Scheer, vice president of advanced patterning process and materials at imec and review selected papers that imec presented.
I asked Steve what the overarching message was at SPIE this year, he said readiness for … Read More
The headline is: Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers. The acquisition complements Ansys’ existing signoff solutions and enables integrated circuit (IC) designers to detect problems earlier in the design flow.
Which is certainly… Read More
As we all know design starts are the life blood of the semiconductor industry, both big and small. Enabling those design starts is what the semiconductor ecosystem is all about and Efabless has a very unique value proposition in this regard.
Efabless is a free cloud-based chip design platform, growing community of 9000+ chip designers,… Read More
It was refreshing to hear a talk focused on emerging stronger from the downturn when the news and media are focused on the gloom. At the recent Siemens EDA User2User conference, Joe Sawicki, executive vice president, IC, gave an uplifting keynote talk to the audience. He highlighted a secular growth trend happening in the semiconductor… Read More
Rethinking Multipatterning for 2nm Node