The Yield Partnership: Intel and PDF Solutions Tackle Advanced NodesOne of the most difficult things to do…Read More
Webinar: Faster Design Spec to Implementation using IP-XACTAs SoC design flows grow increasingly complex, IP-XACT…Read More
Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too LateI recently posted an overview of an upcoming…Read More
Feed Forward Intelligence: Enabling Testability in the Chiplets EraThe semiconductor industry is entering a new era…Read More
Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions Market Leaders Including Cisco,…Read More
And no red and green glasses required.
I remember the first time I heard about a Through Silicon Via (TSV), punching a hole through the entire wafer to make an electrical connection at the back, like we do all the time in printed circuit boards with through plated holes. I thought someone was trying one on and trying to make me look a fool.… Read More
Lip-Bu Tan, the CEO of Cadence, has been named by the Singapore Business Awards as Outstanding CEO (overseas) last week. These awards were launched in 1985 by the Business Times and DHL, so this year is the 27th year of the award, created to recognize business leaders in Singapore and abroad.
As it happens, Cadence flew me first class… Read More
Interesting article from Joel Hruska on ExtremeTech: Nvidia deeply unhappy with TSMC, claims 22nm essentially worthless . The title is a bit dramatic (poetic license) but the charts are accurate to the degree that 20nm costs will be significantly higher from the start and will continue to be higher throughout production and maturity.… Read More
The two large EDA companies offering SOC prototyping with FPGA-based boards are Synopsys and Cadence, however there’s a smaller vendor called Polaris Design Systems that also have a product in this important design verification category. I spoke on Wednesday with Rahm Shastry, CEO of Polaris to learn more about this company… Read More
Sometime early in 2013, Intel will tape out its first production chip for 14nm and it won’t be an x86 processor. It’s neither necessary nor prudent to lead with a new x86 processor when the one missing element that the mobile market desperately needs is nowhere to be found: an ultra low power 4G LTE chip that fits under the battery… Read More
The verification IP (VIP) for Non-Volatile Memory Express (NVMe) announcement from Synopsys is the first fruit issued from the acquisition of ExpertIO. With the proliferation of Nand Flash based storage equipment, or Solid State Drives (SSD), the move from pure SATA based solution was to be expected, sooner or later. Not because… Read More
Getting a feature to take off in today’s smartphone market is tricky. It requires a combination of hardware support, OS support, app integration, and maybe most importantly carrier adoption. Ideas that seem ready technologically, like NFC, get stopped in their tracks by silly things like the William J. LePetomaine Thruway… Read More
Next week is a big deal because it’s when Synopsys has their annual user group meeting, SNUG in Santa Clara at the Convention Center from Monday through Wednesday. I’d love to hear if they have made any decisions on the new product roadmap after the Magma acquisition, although it’s probably too early to tell.… Read More
In my last article I talked about the physical design aspect of 3D-IC. Now looking at its verification aspect, it spans through a wide spectrum of test at hardware as well as software level. The verification challenge goes much beyond that of a SoC which is at a single plane. Even a typical SoC that comprises of a processor core, memory… Read More
The launch from Cadence of the PCI Express 3.0 Controller IP was officially done about one year ago, and demonstrated at the June 2011 PCI-SIG Developer’s Conference, where Cadence Design IP for PCI Express 3.0 controller IP implemented as a high-performance, dual-mode, 128-bit data-path, x8 PCI Express 3.0 controller… Read More
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Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume Fabs