simguru
Member
Here's a Cadence paper from 2002 - http://w2.cadence.com/whitepapers/4064_NanometerWP_fnlv2.pdf
Another from 2003 - In Nanometer IC Design, Accurate Wiring Details Hold The Key To Success
At a presentation about Calibre it was stated that 70% of capacitive load was wiring, but no mention was made of differing path delays on multiple fan out, and there was a suggestion that the margin of error on extracting the wiring data was quite high - i.e. there is a spread that is not being considered in derived simulation models.
Is anybody still using Verilog + SDF for sign-off, and how do the results compare with Spice (and actual results)?
Another from 2003 - In Nanometer IC Design, Accurate Wiring Details Hold The Key To Success
At a presentation about Calibre it was stated that 70% of capacitive load was wiring, but no mention was made of differing path delays on multiple fan out, and there was a suggestion that the margin of error on extracting the wiring data was quite high - i.e. there is a spread that is not being considered in derived simulation models.
Is anybody still using Verilog + SDF for sign-off, and how do the results compare with Spice (and actual results)?