About more than 10 years ago, foundry still worked on more variety of products and less volume in each product, and CPU/memory (intel/Samsung) world were less products and higher volume. We speculated that the foundry world would move to less products and higher volume years after. It was easy to expect the trend will favor intel/Samsung's working model, and tsmc/GF, especially tsmc might take times to adjust their manufacturing methodology. Upon the outcome 10 years later, I am surprised and would say tsmc adjust himself to the new normal and becomes even better than the potential winners now. It takes more than 10 years with clear strategies and executions. As we all know, the old days is you need to understand the technologies in RD thoroughly, ramp in scale and proliferate to high volume manufacturing site by "Copy Exactly". But now, it becomes " Doing before Understanding Thoroughly" be more efficient and find directions by proper "trial and error" work faster. This needs more talented engineers in RD and Fab site (not all scientists) by continuous improvement. tsmc works in the model for years and it seems better fit for the competition. Besides, foundry needs more team works even you have very good technologies. If you do not have mature field tech engineers, seasoned customer service manager to lead the tapeout, product engineers, mask house/litho engineers, reliability engineers..... as a team to plan proper tapeout and new product validation process, it could fail in the first silicon result. Then you lose the cycle (time to market) for at least 3-6 months. In my opinion, to catch up for building the seasoned team, it takes years and might cut short upon using artificial intelligent (like buzz word digital twin) but not that easy.