Pat Gelsinger:
“I am confident that the majority of our 2023 products will be manufactured internally,” he said. “At the same time, given the breadth of our portfolio, it’s likely that we will expand our use of external foundries for certain technologies and products.”
"Based on initial reviews, I am pleased with the progress made on the health and recovery of the 7-nanometer program. I am confident that the majority of our 2023 products will be manufactured internally. At the same time, given the breadth of our portfolio, it's likely that we will expand our use of external foundries for certain technologies and products. We will provide more details on this and our 2023 roadmap once I fully assess the analysis that has been done and the best path forward."
Daniel Nenni:
Remember, a majority is 51%. I stand by my prediction that Intel is the reason why TSMC raised 2021 CAPEX 50%. Pat plans to provide more details after officially taking over on Feb. 15 (next investor call).
Bob Swan:
"In July, we highlighted a challenge with our 7-nanometer technology and started a process to improve it while evaluating the best approach for our 2023 product lineup. Since that time, we have made tremendous progress on our 7-nanometer technology. When 7-nanometer was originally defined, the flow contained a particular sequence of steps that contributed to the defect issue we discussed in July. By re-architecting these steps, we've been able to resolve the defects.
As part of this work over the last six months, we also streamlined and simplified our 7-nanometer process architecture to better ensure we'll be able to deliver on our 2023 product roadmap. The inline data we have been collecting and our pipeline of proven yield development projects gives us confidence in our ability to deliver on our commitments going forward.
At the same time, as Pat mentioned, we will continue to leverage the relationships we've developed over the years with our external foundry partners and believe they can play a larger role in our product roadmap given our disaggregated designs. Once Pat has had a chance to join, he'll further assess our analysis and drive the final manufacturing decision for our 2023 CPU products. Therefore, we'll communicate that decision soon after he takes over, but not today."
Daniel Nenni:
We talked about Intel 10nm yield here:
https://semiwiki.com/forum/index.ph...estion-about-the-10nm-yield.13594/#post-45179 . Not having EUV was a serious issue. Intel 7nm is expected to be full EUV. Given Pat's technical background hopefully he will address 7nm yield issues in more detail in the next call.
In the Q&A 7nm came up a few times. It looks to be scheduled for 2023 while the TSMC equivalent 3nm will be in mass production (Apple iProducst) in 2022 and rest of word in 2023. In my opinion Intel will have a hybrid product roadmap with Intel 7nm and TSMC 3nm starting in 2023.
Pat Gelsinger:
"Let me just add a couple of points to that. This is Pat again. As we said, we believe the majority will be on our 7-nanometers, but we will be increasing the use of foundry capabilities in that timeframe as well."
Daniel Nenni:
Absolutely.