GRENOBLE, France – April 13, 2023 – CEA-Leti will present seven papers on 3D interconnects focused primarily on semiconductor wafer-level platforms at the Electronic Components and Technology Conference (ECTC), May 30-June 2, in Orlando, Fla.
The institute is focusing on achieving high levels of heterogeneous integration of technologies and components on a host silicon wafer through high-density interconnections (fine pitch) to meet requirements of HPC/edge-AI chiplets, optical computing, displays and imagers. It offers a wide range of advanced, complementary technologies such as die-to-wafer and wafer-to-wafer bonding, whose interconnection densities are closely linked to TSVs to keep the densities for layer or ball-grid array (BGA) connections.
Presentation topics:
§ Advanced 3D Integration TSV and Flip-Chip Technologies Evaluation for the Packaging of a Mobile LiDAR 256-channel Beam Steering Device Designed for Autonomous Driving Application
§ Demonstration of a Wafer Level Face-To-Back (F2B) Fine Pitch Cu-Cu Hybrid Bonding with High Density TSV for 3D Integration Applications
§ Process Integration of Photonic Interposer for Chiplet-based 3D Systems
§ Integration and Process Challenges of Self-Assembly Applied to Die-to-Wafer Hybrid Bonding
§ Recent Progress in the Development of High-Density TSV for 3-Layer CMOS Image Sensors
§ 3D Silicon Interposer for Terabit/s Transceivers Based on High-Speed TSVs
§ Characterizations of Indium Interconnects for 3D Quantum Assemblies
CEA-Leti’s Stéphane Bernabé will co-chair the special session on Photonics Packaging, May 30 at 1:30 – 3:00 p.m.
In addition, a Best Poster award from ECTC 2022 will be awarded to Aurélia Plihon et al, for their poster: “Scalable Through Mold Interconnection Realization for Advanced Fan-Out Wafer-Level Packaging Applications”.
CEA-Leti experts will be onsite at booth 234 and available to discuss the findings in the presentations.
About CEA-Leti
Leti, a technology research institute at CEA, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, CEA-Leti pioneers micro-& nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, CEA-Leti’s multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 1,900, a portfolio of 3,200 patents, 11,000 sq. meters of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley and Tokyo. CEA-Leti has launched 76 startups and is a member of the Carnot Institutes network. Follow us on www.leti-cea.com and @CEA_Leti.
Technological expertise
CEA has a key role in transferring scientific knowledge and innovation from research to industry. This high-level technological research is carried out in particular in electronic and integrated systems, from microscale to nanoscale. It has a wide range of industrial applications in the fields of transport, health, safety and telecommunications, contributing to the creation of high-quality and competitive products.
For more information: www.cea.fr/english
Press Contact
Agency
Sarah-Lyle Dampoux
sldampoux@mahoneylyle.com
+33 6 74 93 23 47
The institute is focusing on achieving high levels of heterogeneous integration of technologies and components on a host silicon wafer through high-density interconnections (fine pitch) to meet requirements of HPC/edge-AI chiplets, optical computing, displays and imagers. It offers a wide range of advanced, complementary technologies such as die-to-wafer and wafer-to-wafer bonding, whose interconnection densities are closely linked to TSVs to keep the densities for layer or ball-grid array (BGA) connections.
Presentation topics:
§ Advanced 3D Integration TSV and Flip-Chip Technologies Evaluation for the Packaging of a Mobile LiDAR 256-channel Beam Steering Device Designed for Autonomous Driving Application
§ Demonstration of a Wafer Level Face-To-Back (F2B) Fine Pitch Cu-Cu Hybrid Bonding with High Density TSV for 3D Integration Applications
§ Process Integration of Photonic Interposer for Chiplet-based 3D Systems
§ Integration and Process Challenges of Self-Assembly Applied to Die-to-Wafer Hybrid Bonding
§ Recent Progress in the Development of High-Density TSV for 3-Layer CMOS Image Sensors
§ 3D Silicon Interposer for Terabit/s Transceivers Based on High-Speed TSVs
§ Characterizations of Indium Interconnects for 3D Quantum Assemblies
CEA-Leti’s Stéphane Bernabé will co-chair the special session on Photonics Packaging, May 30 at 1:30 – 3:00 p.m.
In addition, a Best Poster award from ECTC 2022 will be awarded to Aurélia Plihon et al, for their poster: “Scalable Through Mold Interconnection Realization for Advanced Fan-Out Wafer-Level Packaging Applications”.
CEA-Leti experts will be onsite at booth 234 and available to discuss the findings in the presentations.
About CEA-Leti
Leti, a technology research institute at CEA, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, CEA-Leti pioneers micro-& nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, CEA-Leti’s multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 1,900, a portfolio of 3,200 patents, 11,000 sq. meters of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley and Tokyo. CEA-Leti has launched 76 startups and is a member of the Carnot Institutes network. Follow us on www.leti-cea.com and @CEA_Leti.
Technological expertise
CEA has a key role in transferring scientific knowledge and innovation from research to industry. This high-level technological research is carried out in particular in electronic and integrated systems, from microscale to nanoscale. It has a wide range of industrial applications in the fields of transport, health, safety and telecommunications, contributing to the creation of high-quality and competitive products.
For more information: www.cea.fr/english
Press Contact
Agency
Sarah-Lyle Dampoux
sldampoux@mahoneylyle.com
+33 6 74 93 23 47