Yes, Samsung did their foundry press briefing on Tuesday. It was interesting.
"GAA is ready for customers' adoption - 3nm MP in 2022, 2nm in 2025 With its enhanced power, performance and flexible design capability, Samsung’s unique GAA technology, MultiBridge-Channel FET (MBCFETTM), is essential for continuing process migration. Samsung's first 3nm GAA process node utilizing MBCFET will allow up to 35 percent decrease in area, 30 percent higher performance or 50 percent lower power consumption compared to the 5nm process. In addition to power, performance, and area (PPA) improvements, as its process maturity has increased, 3nm’s logic yield is approaching a similar level to the 4nm process, which is currently in mass production. Samsung is scheduled to start producing its customers' first 3nm-based chip designs in the first half of 2022, while its second generation of 3nm is expected in 2023. Newly added to Samsung’s technology roadmap, the 2nm process node with MBCFET is in the early stages of development with mass production in 2025."
Hopefully Samsung 2GAP will be competitive to TSMC N3 because Samsung 3GAP is not.
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