Chip-to-Chip Communication (Interlaken-LL) for Enterprise and Cloud

Thu, Mar 19, 2020 11:00 AM - 12:00 PM MDT ** Work email address required** Interlaken chip-to-chip connectivity IP has been used for many years in networking and switching fabrics to move high throughput data between large chips. With advanced technology nodes, increasing chip sizes and CPU cluster-based designs, Interlaken has found a unique spot …

WEBINAR: Protocol Agnostic Die-to-Die Connectivity for Chiplets and HPC

Webinar Overview With recent advances in packaging technology it is possible to connect multiple dies on a single package. OpenFive’s D2D Controller provides end to end connection from one die to another. In this webinar we will review trade-offs between various connectivity options. We will also review the application of D2D in Chiplets and HPC …