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Technical Education Webinar Series: Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs
Technical Education Webinar Series: Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs
Sponsored by: Cadence Presented by: Nitin Bhagwath, Director of Product Management Event Duration: 60 minutes Abstract: Signal integrity/power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density circuit boards. Faster signoff of designs can be achieved by uncovering signal SI/PI issues early in the design process. This webinar will highlight three key issues engineers need to …