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In this webinar, Synopsys and Arm describe how their recent collaboration helps maximize system performance and shorten Arm-based SoC design cycles. Learn how to minimize HPC/data center SoC design risk and ensure end-to-end IP integration, using available Arm reference designs and interoperability reports. Find out how Synopsys’ interface IP for the most widely used protocols …
March 15th @ 11am PT | 2pm ET With the formal release of the HBM3 specification, memory bandwidth for AI/ML and HPC shifts to a higher gear. Terabytes of bandwidth are possible using HBM3’s 2.5D/3D architecture. Join memory expert Frank Ferro as he discusses what changes come with the new generation of HBM, and how …
Part of Simulating for High-Speed Digital Insights series April 14, 2022 | 10:00 AM PT / 1:00 PM ET Due to ever increasing data demand, the speed grade for memory is now in the multi-gigabit range. Memory bus design becomes a lot more complicated with tighter design margins due to higher crosstalk between vias and traces along …
Santa Clara Convention Center
5001 Great America Pkwy, Santa Clara, CA, United States
Why Attend Flash Memory Summit? FMS is the best networking opportunity in the storage industry! The 2022 conference is expanding beyond flash memory to address all forms of high performance memory. Summit organizers welcome your submissions on a range of memory technologies including NAND Flash, DRAM, MRAM, ReRAM, and DNA storage. Submissions are also encouraged …
When: August 11, 2022 Where: Online Time: 10:00am-10:30am-(PDT) Language: English When employing process simulation to generate a complex device structure, TCAD engineers often face the task of reproducing the exact etch profile that has been observed in semiconductor fabrication. Silvaco Victory Process offers several geometric models to efficiently achieve etch geometries that accurately match microscopy …
Summary Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability to match and how to plan ahead for verification of die-to-die interconnect protocols such as UCIe and memory verification with HBM. Packaging technologies for 2.5D and 3DIC are becoming …
Part of Keysight's 'Simulating for High-Speed Digital Insights' webinar series October 13, 2022 | 10:00 AM PT / 1:00 PM ET Successful memory interface design is more than building and simulating one design that works to the given specification. As a designer, your success relies on making a robust implementation that works for different corner cases, process variations, BOM …
