Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated …
Continue reading "Webinar: Power Integrity Challenges and Solutions for Interposer Design"
Date: Wednesday, July 26, 2023 Time: 10:00am PDT | 1:00pm EDT 3D-IC design requires early analysis of thermal properties, power delivery, and signal integrity. This webinar will work through the process of simulating heterogeneously integrated chiplets. Learn about the integrated workflow that begins with silicon design data being accurately modeled with 3D FEM extraction. The …
Continue reading "Cadence TECHTALK: Solution for 3D-IC Interposer Signal Integrity"
