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Webinar: Thermal Integrity Challenges and Solutions of Silicon Interposer Design

Online

In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation will cover thermal hotspots, mechanical stresses induced by thermal issues, and methods for capturing these problems with simulation and virtual prototyping, with a focus on designs that utilize silicon interposers. …

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Webinar: Power Integrity Challenges and Solutions for Interposer Design

Online

Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with the dice instantiated in a 3D-IC device. The presentation will then explore the completed multi-chip design in a system simulation. …

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Cadence TECHTALK: Solution for 3D-IC Interposer Signal Integrity

Online

Date: Wednesday, July 26, 2023 Time: 10:00am PDT | 1:00pm EDT 3D-IC design requires early analysis of thermal properties, power delivery, and signal integrity. This webinar will work through the process of simulating heterogeneously integrated chiplets. Learn about the integrated workflow that begins with silicon design data being accurately modeled with 3D FEM extraction. The …

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