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CadenceTECHTALK: In-Design EM Analysis Addresses RF System Integration Challenges

Online

Date: Tuesday, September 20, 2022 Time: 10:00am PDT / 1:00pm EDT The RF PA MMIC worked as designed until it was integrated into the module housing, and then the overall performance shifted out of spec. Design failure at the point of system integration is a common cause of delayed product deliveries and engineering cost overruns. …

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Cadence May 2 2023

Cadence TechTalk: Design Robust IC Packages Faster Using In-Design SI/PI Analysis

Online

IC package design teams and characterization teams have had a “throw-it-over-the-wall” relationship for decades, which often delays design releases by months. However, as signal integrity (SI) and power integrity (PI) challenges evolve with multi-die heterogeneous integration, the need to perform SI/PI analysis as part of the design flow has become a requirement to meet compressed …

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