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Overview Do you want to find out, hands-on, how many of the leading fabless semiconductor companies are verifying their complex 2.5/3D heterogeneous and homogeneous package assemblies? Here is your chance to meet our technical staff and ask your questions. Come and see why fabless semiconductor companies are adopting this flow, irrespective of the Package layout …
Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: (1) pitch conversion between the fine features of the IC die and the system level interconnection, (2) chemical, environmental and mechanical protection, (3) heat transfer, (4) power, ground and signal distribution between the die and system, (5) …
