Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
OnlineDate: Tuesday, June 14, 2022 Time: 09:00 BST / 10:00 CEST / 11:00 EEST and Israel / 13:30 IST System designers face increasing challenges to meet technical specification and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continue to grow. Large pin counts of flipped and rotated ICs may accidentally lead …
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