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Webinar: An Intelligent System Design Platform for Chiplet-Based Architectures

Date and Time Wednesday, May 27, 2020 Time: 10:00am - 11:00am (PDT) Providing the best alternative to advanced monolithic SoCs, multi-chiplet packages have become a very attractive option for the next generation of cost-sensitive designs. However, as many engineers begin to realize the benefits of a multi-chiplet packaging approach, including 3D stacking, they are struggling …

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SEMICON Japan + Advanced Packaging and Chiplet Summit

Tokyo Big Sight 3 Chome-11-1 Ariake, Koto City, Tokyo, Japan

December 14-16, 2022 Venue: Tokyo Big Sight SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging …

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