Agenda 08:30 – 09:30 Registration & Ecosystem Pavilion 09:30 – 09:45 Welcome Remarks 09:45 – 10:15 TSMC Keynote 10:15 – 10:45 Coffee Break & Ecosystem Pavilion TSMC Technical Talks 10:45 – 11:15 TSMC Technical Talk OIP Partner Technical Talks 11:15 – 12:15 Partner Technical Session 1 to 3 12:15 – 13:30 Lunch & Ecosystem Pavilion …
Regional competitions / July 2-7, 2024 Teams from all over the Asia-Pacific and the Middle East come together in this competition of engineering excellence and energy efficiency. Keep an eye on this page for more details and updates. Asia-Pacific and the Middle East region Phase 1 registration: September 21, 2023 - February 1, 2024 Teams are …
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Join us at SFF & SAFE™ Forum 2024 We’re inviting global partners and customers to our upcoming Samsung Foundry Forum (SFF) and Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2024. The …
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NAFEMS Americas will be hosting its biennial regional conference on July 9-11, 2024, in Louisville, Kentucky, USA. The 2024 NAFEMS Americas Conference will bring together the leading visionaries, developers, and practitioners of CAE-related technologies in an open forum, unlike any other, to share experiences, discuss relevant trends, discover common themes, and explore future issues, including: What is the …
SEMICON West brings the incredibly diverse global electronics supply chain together to address the semiconductor ecosystem’s greatest opportunities and challenges through programs highlighting Market Intelligence | Standards | Sustainability | Workforce Development | SEMI University | Supply Chain Management | and …
Analyzing electrical errors across an IP or a SoC at top level, can be a painful and long process, often requiring extensive setup time and hundred of hours to distinguish real issues from false positives. To address this challenge, Aniah developed OneCheck, a formal analysis tool capable of detecting 100% of electrical errors at the …
About HPC enables the computation that makes capturing, producing, and optimizing energy possible. The global demand for energy from many varied sources is growing. Join us to learn how our solutions support robust computing performance and the …
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Electronic components design and their integration on PCBs involve complex simulations to accurately predict EM fields and forces. These simulations can be computationally intensive and time-consuming. High-performance computing (HPC) capability …
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Ensuring my Design Verification is ISO26262 Compliant With the widespread of the modern automobiles, run and regulated by automotive ECUs, the need for advanced safety features has also become inevitable. …
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Join CEA-Leti CEO Sébastien Dauvé and a panel of tech experts and partners at Leti Semicon Workshop on July 9, 2024 – San Francisco CEA-Leti is setting up a novel …
Ensuring reliable performance of products in the field requires verification and validation at the system level. This means considering the complex interaction of different physics between systems and sub-systems. In …
Whether you’re conducting safety analyses at the system, software, or hardware level, medini analyze can help you achieve: Up to 50% increased efficiency in your functional safety analyses, End-to-end traceability, including integration …
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About The Conference We are delighted to announce the AESIN Conference 2024 to be held on 11th July. This year’s AESIN theme is Collaboration in a technology rich era. We will be celebrating UK’s outstanding automotive electronics related organisations as we bring technology to the forefront. Come together with fellow industry leaders and experts as …
Join us at Virtual Prototyping Day 2024 to hear about the latest deployed virtual prototyping innovations. This event highlights applications from around the world using the latest virtual prototyping technology, covering applications from automotive, AI, and data center domains. Industry leaders will share their experiences with the latest techniques and methodologies using virtual prototypes for …
Description Today’s wireless and high-speed chip designs integrate an incredible amount of functionality on very small silicon real estate. Such integration requires optimization from the early stages of the design …
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Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their …
Today, we find ourselves at the nexus of the fourth industrial revolution — an era dominated by Smart Everything. The internet, artificial intelligence, and the use of software are helping …
The digital chip design flow carries with it an enormous wealth of untapped information regarding the health and status of your SoC design. The ability to efficiently mine this data provides chip designers with comprehensive visibility and actionable insights to uncover PPA opportunities. This webinar will introduce you to Synopsys Design.da, the industry’s first comprehensive data-visibility …
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This webinar equips you with effective strategies to tackle randomization-related errors within your UVM verification environment. We'll explore the power of Cadence's Verisium Debug, a tool designed to simplify the …
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Leveraging functional patterns is crucial for achieving high defect coverage and reducing defective parts per million (DPPM) levels. Synopsys VC Z01X fault simulator offers enhanced fault coverage in manufacturing test flows, complementing ATPG tools like Synopsys TestMAX ATPG. In this presentation we will delve into unique coverage scenarios, such as resets and clocks blocked during ATPG mode. We'll …
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Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their knowledge, stay current with the latest hardware security advancements and learn more about security IP solutions. Each week, we will explore a critical topic in …
Join us for an exclusive webinar during Ansys 2024 R2 updates. We'll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, with expanded capabilities. TIME: JULY 18, 2024 11 AM EDT Venue: Virtual Overview This Ansys 2024 R2 webinar reviews the updates, enhancements, and new features …
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Welcome to Nuclear & Space Radiation Effects Conference On behalf of the Institute of Electrical and Electronics Engineers (IEEE), its Nuclear and Plasma Sciences Society (NPSS), the Radiation Effects Steering …
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Every two years, the aerospace, aviation and defence industries are invited to Farnborough International Exhibition & Conference Centre for the world’s best airshow to pioneer change, build new connections, engage …
Conference introduction Digital transformation is happening at an unprecedented pace, are you involved? How to move from simply discovering problems to solving them in real time? How can you improve …
About this event As electronics grow denser and interconnects more intricate, the design process becomes increasingly challenging. Designers need increased automation and cross-functional collaboration to adhere to stringent industry standards. …
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their …
This webinar covers how Ansys solutions address battery management challenges and complexities: model-based functional safety analysis and safety-critical BMS software development, BMS integration, and validation. TIME: JULY 31, 2024 9 …
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09:00 am – 10:30 am CST (UTC+8), Thursday, August 1 Meet the Industry Experts from TSMC Organizations Get an inside look on the world’s largest semiconductor foundry Have a chance …
Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their …
During the 38th Annual Small Satellite Conference, we will explore how automation is being integrated into small satellite systems across the space, launch, ground, and user segments, making them smarter …
Overview The AVS 24th International Conference on Atomic Layer Deposition (ALD 2024) featuring the 11th International Atomic Layer Etching Workshop (ALE 2024) will be a three-day meeting dedicated to the science and technology of …
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Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
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