NAFEMS Americas Conference

Louisville, Kentucky, USA Louisville, KY, United States

NAFEMS Americas will be hosting its biennial regional conference on July 9-11, 2024, in Louisville, Kentucky, USA. The 2024 NAFEMS Americas Conference will bring together the leading visionaries, developers, and practitioners of CAE-related technologies in an open forum, unlike any other, to share experiences, discuss relevant trends, discover common themes, and explore future issues, including: What is the …

Semicon West 2024

Moscone Center 747 Howard Street, San Francisco, CA, United States

SEMICON West brings the incredibly diverse global electronics supply chain together to address the semiconductor ecosystem’s greatest opportunities and challenges through programs highlighting  Market Intelligence | Standards | Sustainability | Workforce Development | SEMI University | Supply Chain Management | and much more! COLLECTIVELY SEMI member companies provide the equipment, materials, software, devices, and services that enable technologies to create a smarter world.  JOINTLY we align and aggregate …

AESIN Conference 2024

British Motor Museum Banbury Road Gaydon, Lighthorne Heath, Warwick, United Kingdom

About The Conference We are delighted to announce the AESIN Conference 2024 to be held on 11th July. This year’s AESIN theme is Collaboration in a technology rich era. We will be celebrating UK’s outstanding automotive electronics related organisations as we bring technology to the forefront. Come together with fellow industry leaders and experts as …

Synopsys Virtual Prototyping Day 2024

Online

Join us at Virtual Prototyping Day 2024 to hear about the latest deployed virtual prototyping innovations. This event highlights applications from around the world using the latest virtual prototyping technology, covering applications from automotive, AI, and data center domains.​ ​Industry leaders will share their experiences with the latest techniques and methodologies using virtual prototypes for …

Webinar: Chip-Level Electromagnetic Crosstalk Signoff Using EMX Solver

Description Today’s wireless and high-speed chip designs integrate an incredible amount of functionality on very small silicon real estate. Such integration requires optimization from the early stages of the design to post-layout vs. schematic (LVS) signoff. Increasingly complex designs and advanced process nodes test the limits of electromagnetic (EM) solvers in terms of modeling capacity …

Webinar: Root of Trust

Online

Summary Join us for a weekly webinar series focusing on cutting-edge design and implementation techniques for hardware security. This series is perfect for engineers and designers looking to strengthen their knowledge, stay current with the latest hardware security advancements and learn more about security IP solutions. Each week, we will explore a critical topic in …

Webinar: Maximize Productivity with Deep Insights into PPA Trajectories

Online

The digital chip design flow carries with it an enormous wealth of untapped information regarding the health and status of your SoC design. The ability to efficiently mine this data provides chip designers with comprehensive visibility and actionable insights to uncover PPA opportunities. This webinar will introduce you to Synopsys Design.da, the industry’s first comprehensive data-visibility …

Webinar: Efficient Way to UVM Constraint Randomization Debug

This webinar equips you with effective strategies to tackle randomization-related errors within your UVM verification environment. We'll explore the power of Cadence's Verisium Debug, a tool designed to simplify the debugging process. What You Will Learn Practical techniques for isolating and resolving randomization-related errors Optimize your UVM verification environment for robust functionality Gain valuable insights …

Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update

Online

Join us for an exclusive webinar during Ansys 2024 R2 updates. We'll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, with expanded capabilities. TIME: JULY 18, 2024 11 AM EDT Venue: Virtual Overview This Ansys 2024 R2 webinar reviews the updates, enhancements, and new features …

Realize LIVE China 2024

The Royal Sheshan Hotel, Shanghai, a Tribute Portfolio Hotel No. 1288 Linyin New Road, Sheshan, Shanghai, China

Conference introduction Digital transformation is happening at an unprecedented pace, are you involved? How to move from simply discovering problems to solving them in real time? How can you improve …