The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in …
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Join colleagues at the largest optical manufacturing conference and exhibition in North America SPIE Optifab is the premier event to meet with top companies and learn about the latest optical …
RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive, data …
Event Summary The year 2025 is both a turning point for integrated photonics as a key enabler for AI, physical and infrastructure interconnect, and the International Year of Quantum (IYQ). …
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Europe's Role & Chips Act 2.0 Priorities The European Union is currently developing a new version of the Chips Act program. The European Chips Act 2.0 represents a strategic initiative …
*Work Email Required* Edge AI systems increasingly require on-chip integration of large-capacity memory, compute engines, and inference-optimized accelerators—all within strict power, latency, and footprint constraints. This webinar provides a an overview of IP architecture and integration methodologies that support real-time AI workloads at the edge. We’ll cover: • Memory and compute efficiency: Techniques for optimizing …
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Join us for the 2025 TSMC OIP ECOSYSTEM FORUM Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn't just an event; it's a dynamic hub where the brightest minds converge to ignite the next wave of innovation. As the AI …
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The 2025 International Conference on Computer-Aided Design Call For Papers Jointly sponsored by IEEE and ACM, IEEE ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, and identify emerging technologies in the electronic design automation research areas. IEEE ICCAD covers the full range of CAD topics – from device and circuit …
The increasing demand for accelerated computing solutions calls for an agile hardware design methodology to be able to keep up with fast evolving landscape of algorithms. Traditional hardware design methodology has long development cycles involving defining architecture, doing microarchitecture development using RTL, and performing verification. An agile workflow requires being able to iterate through the …
CadenceCONNECT: Jasper User Group 2025 is October 29 and 30 in San Jose, CA. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world to share the latest design and verification practices based on Cadence’s Jasper formal verification technologies and methodologies. The Jasper User Group Conference is the premier …
As digital chip design complexity grows, engineering teams face increasing pressure to meet aggressive PPA targets on tight schedules. To overcome this challenge, the EDA industry requires a revolutionary shift towards AI. Siemens EDA is leading this transformation by implementing a comprehensive strategy that combines machine learning, reinforcement learning, generative, and agentic AI across the …
Description BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar. Unlock the potential of the AMD Kria SOM and discover Time-Sensitive Networking (TSN) benefits for your applications. In this session, you’ll explore the TSN-ROS application and its role in enhancing communications within a TSN framework. Join our hands-on demonstration to …
October 29, 2025 - 11:00 AM EST October 30, 2025 – 10:00 AM JST/KST Discover the 5 Critical Memory Market Trends Reshaping Semiconductors in 2026 AI workloads, HBM4 adoption, and 3D NAND scaling—what’s next for the memory industry in 2026. The memory semiconductor industry is entering a critical inflection point. Explosive AI workloads are pushing …
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Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is …
Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 …
Scaling Together in a Dynamic World The photonic chip industry is reaching new heights - but scaling production, applications, and investments requires a united effort. As demand surges for high-speed, energy-efficient solutions, the question isn’t if photonic chips will revolutionise industries, but how fast we can make it happen. At PIC Summit Europe 2025, we …
Connect to the embedded community With its 20 years of history and experience in Europe, embedded world is the most professional and largest exhibition in its field, and has accumulated substantial industry and customer data and media resources. It gathers the leading enterprises of the global embedded industry, with its application range covering automotive electronics, …
