MIPI DevCon 2020

A Virtual Event 22-23 September | 07:00-11:00 PDT MIPI DevCon will be offering its previously scheduled Osaka event virtually 22-23 September 2020,  to ensure that developers continue to have access to valuable education related to the implementation of MIPI specifications in mobile and in markets such as IoT, wearables, industrial and automotive. Details related to …

Achieve Silicon-to-System Success at IDEAS Digital Forum

Achieve Silicon-to-System Success at IDEAS Digital Forum September 23-24, 2020 Ansys is at the forefront of semiconductor enablement in partnership with the world’s leading companies for AI and machine learning, high-performance computing, 5G, hardware security and autonomous vehicles. Join us for the IDEAS Digital Forum — a place to catch up on the latest advances …

GF GTC 2020 – NORTH AMERICA

ACCELERATING THE DIGITAL FUTURE INNOVATING & COLLABORATING TOGETHER On behalf of our CEO Dr. Tom Caulfield and the rest of our GF team, we are excited to invite you to GTC 2020 North America, GF’s first 100% virtual event. The world has changed dramatically in the last several months. People are reimagining the way they …

Edge Computing World 2020

THE WORLD’S LEADING EDGE COMPUTING EVENT- LIVE ONLINE ! The Only Event That Brings Together the Entire Edge Ecosystem with Developers and Users to Drive Forward the Next Evolution of the Internet  Edge Computing World is back! In 2020 we will bring you the same high quality content and networking that won widespread plaudits last year …

Linley Fall Processor Conference 2020

For more than a decade, The Linley Group has delivered the industry’s premier processor conference. This year, the Linley Fall Processor Conference will feature virtual presentations that run half days on October 20-22 and 27-29, 2020. As you’ve come to expect from our past conferences, we’ll feature the same high-quality technical content while enabling attendees …

WEBINAR: Protocol Agnostic Die-to-Die Connectivity for Chiplets and HPC

Webinar Overview With recent advances in packaging technology it is possible to connect multiple dies on a single package. OpenFive’s D2D Controller provides end to end connection from one die to another. In this webinar we will review trade-offs between various connectivity options. We will also review the application of D2D in Chiplets and HPC …

Leti Device Workshop

This period of pandemic and confinement has fostered telework and remote relationships. As a result, data transfers around the world have increased dramatically. During its annual Devices Workshop, CEA-Leti will share its vision on the management of data in all its forms, from capture to safe restitution. PROGRAM Efficient and frugal solutions  for date-deluge management …

2020 IEEE International Electron Devices Meeting To Be Held Virtually

PISCATAWAY, NJ (June 24, 2020) –The organizers of the upcoming 66th annual IEEE International Electron Devices Meeting (IEDM), the world’s premier forum for technological breakthroughs in semiconductor and electron device technology, have decided to hold the conference virtually this year given the ongoing uncertainties posed by the prevailing COVID-19 pandemic. The virtual 2020 IEDM is …

Too Hot to Test 2021

As the industry moves to develop creative artificial intelligence (AI) and other advanced computing devices, the power consumption per semiconductor device has skyrocketed. This brings with it challenges in power deliver as well as device cooling. The virtual workshop Too Hot to Test will explore the cross-functional challenges associated with testing high-power devices. The focus will be …

LOPEC 2021: The world’ s leading platform

Digitally, too, it is THE world’s meeting point for the printed electronics sector: LOPEC. In 2021 for the first time, it will be held fully online. LOPEC—short for Large-area, Organic and Printed Electronics Convention—is the leading international platform in the field of printed electronics. Year after year, it brings together leading players from application to research …

CASPA 2021 Spring Symposium: Semiconductor in Digital Transformation

About this Event Prof. Zhenan Bao, Professor, Stanford University Title: Skin-Inspired Organic Electronics Abstract: Skin is the body’s largest organ, and is responsible for the transduction of a vast amount of information. This conformable, stretchable, self-healable and biodegradable material simultaneously collects signals from external stimuli that translate into information such as pressure, pain, and temperature. …

The 2021 MRS Spring Meeting & Exhibit Is Going Virtual!

Time and time again, "multidisciplinary" research is touted as essential to innovation. That is why, from April 17-23, 2021, researchers working in seemingly unrelated fields will gather virtually to promote, share and discuss issues and developments across disciplines. The 2021 MRS Spring Meeting & Exhibit is the key forum to present research to an interdisciplinary and international audience. It provides …