About the Event Join Altair’s high-performance and high-throughput computing experts, along with our partners, technology users, and industry peers, for a virtual summit exploring the leading-edge enterprise computing solutions that will keep innovation moving forward in 2020, and beyond. High-performance Computing and IT Optimization Track Topics for IT stakeholders on high-performance and high-throughput computing workload management include live …
The major annual event of the Israeli semiconductor industry ChipEx2020 is the largest annual event of the Israeli semiconductor industry. This year, due to the Covid 19 crisis, we decided to do it fully virtual. Therefore, it is going to be called ChipEx2020 Digital and will take place on September 16, 2020. ChipEx2020 Digital is produced by ASG Ltd. in cooperation with SIA, …
A Virtual Event 22-23 September | 07:00-11:00 PDT MIPI DevCon will be offering its previously scheduled Osaka event virtually 22-23 September 2020, to ensure that developers continue to have access …
Achieve Silicon-to-System Success at IDEAS Digital Forum September 23-24, 2020 Ansys is at the forefront of semiconductor enablement in partnership with the world’s leading companies for AI and machine learning, …
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ACCELERATING THE DIGITAL FUTURE INNOVATING & COLLABORATING TOGETHER On behalf of our CEO Dr. Tom Caulfield and the rest of our GF team, we are excited to invite you to …
THE WORLD’S LEADING EDGE COMPUTING EVENT- LIVE ONLINE ! The Only Event That Brings Together the Entire Edge Ecosystem with Developers and Users to Drive Forward the Next Evolution of the Internet Edge Computing World is back! In 2020 we will bring you the same high quality content and networking that won widespread plaudits last year …
For more than a decade, The Linley Group has delivered the industry’s premier processor conference. This year, the Linley Fall Processor Conference will feature virtual presentations that run half days on October 20-22 and 27-29, 2020. As you’ve come to expect from our past conferences, we’ll feature the same high-quality technical content while enabling attendees …
Webinar Overview With recent advances in packaging technology it is possible to connect multiple dies on a single package. OpenFive’s D2D Controller provides end to end connection from one die …
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This period of pandemic and confinement has fostered telework and remote relationships. As a result, data transfers around the world have increased dramatically. During its annual Devices Workshop, CEA-Leti will share its vision on the management of data in all its forms, from capture to safe restitution. PROGRAM Efficient and frugal solutions for date-deluge management …
PISCATAWAY, NJ (June 24, 2020) –The organizers of the upcoming 66th annual IEEE International Electron Devices Meeting (IEDM), the world’s premier forum for technological breakthroughs in semiconductor and electron device technology, have decided to hold the conference virtually this year given the ongoing uncertainties posed by the prevailing COVID-19 pandemic. The virtual 2020 IEDM is …
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As the industry moves to develop creative artificial intelligence (AI) and other advanced computing devices, the power consumption per semiconductor device has skyrocketed. This brings with it challenges in power deliver as well as device cooling. The virtual workshop Too Hot to Test will explore the cross-functional challenges associated with testing high-power devices. The focus will be …
Digitally, too, it is THE world’s meeting point for the printed electronics sector: LOPEC. In 2021 for the first time, it will be held fully online. LOPEC—short for Large-area, Organic and Printed Electronics Convention—is the leading international platform in the field of printed electronics. Year after year, it brings together leading players from application to research …
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About this Event Prof. Zhenan Bao, Professor, Stanford University Title: Skin-Inspired Organic Electronics Abstract: Skin is the body’s largest organ, and is responsible for the transduction of a vast amount of information. This conformable, stretchable, self-healable and biodegradable material simultaneously collects signals from external stimuli that translate into information such as pressure, pain, and temperature. …
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