ChipEx2021 is the main conference of the chip industry in Israel. The next conference will be held on June 21-22 , 2021, in Tel Aviv. On the first day, a physical conference will be held at the “Expo Tel Aviv” conference center, at the Tel Aviv Exhibition Center. The second day will be dedicated to a virtual conference for international companies that will not be able to come to Israel. The conference and its format are identical to the major industry conferences held around the world. ChipEx2021 is produced by ASG Ltd. in collaboration with SIA – the Association of Chip Companies in the United States and the International Semi Association .
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The purpose of the conference is to update the people of the chip industry in Israel on technological innovations and in the direction intended for all those involved in the microelectronics industry ChipEx2021 . Industry Development Multi-company, Fabless includes engineers, development managers, senior executives and CEOs of national companies, planning centers, consultants and experts, venture capitalists involved in the industry, as well as students and lecturers in electricity / electronics / computers in the various university faculties.