Ansys and NVIDIA Collaboration Will Be On Display at DAC 2024

Highlights:

• NVIDIA will be demonstrating Ansys solutions running on NVIDIA GPU hardware in the Ansys booth
• Ansys CTO Prith Banerjee will speak at the DAC panel on EDA and Disruptive Technologies titled “Why Is EDA Playing Catchup to Disruptive Technologies Like AI? What Can We Do to Change This?”.
• Register for the 6 Ansys’ Customer Workshops in the Ansys exhibit booth
• Ansys is presenting on the Exhibitor Forum stage with guest speakers from NVIDIA, Qualcomm and MatX.
• Ansys customers have contributed over 24 technical papers to the DAC conference Engineering Track

In less than two weeks the 2024 Design Automation Conference and Exhibit will start on June 23^rd  in San Francisco. Ansys will be showcasing its 3DIC Multiphysics solutions together with NVIDIA in the Ansys booth where Ansys solutions will be shown running natively on NVIDIA GPU hardware.

More collaboration with NVIDIA will be on show at the DAC Exhibitor Forum sessions sponsored by Ansys every day from 1:45pm – 3:00pm:

• Monday 6/24: “Understanding Ansys SigmaDVD – A Radical New Methodology for Voltage Drop Analysis and Signoff” with Chip Stratakos – MatX, Mohit Jain – Qualcomm, and Murat Becer – Ansys:

One of the most difficult challenges for IC designers today is power integrity signoff at advanced nodes and how to achieve comprehensive dynamic voltage drop (DVD) coverage. Attend this session to learn how leading IC design teams no longer rely only on traditional vectored/vectorless analysis but are adopting a radical new SigmaDVD™ technology from Ansys to address urgent DVD issues at advanced nodes . SigmaDVD is becoming the leading method for avoiding DVD voltage and timing problems, shift-left prevention of voltage-drop issues, fixing IR violations, and achieving robust, high-coverage power integrity signoff.

• Tuesday 6/25: “Leveraging AI/ML for Electronic Design and Simulation” a thought-leadership discussion between Prith Banerjee – Ansys, and Sanjay Choudhry – NVIDIA:

AI/ML is causing sweeping changes in almost every industry, and electronic design and simulation are no exceptions. EDA tools have a long history of using heuristics and numerical approximations to ensure designer productivity keeps pace with Moore’s Law. This session will feature Ansys CTO Prith Banerjee joined by industry speakers to discuss today’s practical application of AI/ML for electronic design and simulation, and how this trend will determine the direction of EDA in the future.

• Wednesday 6/26: “Visualizing the Future of Multi-die Design with Ansys & NVIDIA Omniverse” a demonstration of advanced visualization of 3DIC multiphysics powered by NVIDIA’s Omniverse technology:

Ansys and NVIDIA collaborate closely to enable designers to bring a new paradigm to IC design: Visualizing and optimizing multi-die designs with NVIDIA’s  Omniverse technology. In combination with Ansys electromagnetic, thermal, and mechanical simulation it can provide capabilities never before seen in IC design. This session features representatives from Ansys and NVIDIA demonstrating Ansys solutions operating with NVIDIA’s Omniverse for practical optimization solutions. The session will also cover key aspects of the companies’ collaborations on AI and GPU design and enablement, as debuted in Jensen Huang’s GTC 2024 keynote.

Ansys’ chief technology officer, Prith Banerjee, will be sharing his insights with the DAC Research panel “Why Is EDA Playing Catchup to Disruptive Technologies Like AI?” on Wednesday at 11:30am.

The Ansys 40×40 booth (#1308) is one of the larger ones in this year’s Exhibit, with its major theme of 3DIC Multiphysics simulation and signoff. NVIDIA will be participating in the Ansys booth with a demonstration of its GPU hardware running Ansys simulations solutions. Customers can also register to attend a series of 6 technical Customer Workshops in the Ansys booth where Ansys customers present detailed technical summaries of their experiences and successes in applying Ansys technology for their production IC designs.

Ansys will be presenting in the Intel Foundry booth on support for Intel 18A and advanced backside power delivery technology. Ansys will also present in the Microsoft booth on the cloud-enablement collaboration with Azure to optimize compute times and costs for designing large AI/ML, HPC, networking , and automotive designs.

The impressively broad usage of Ansys products across the semiconductor industry has once again enabled Ansys customers to submit an equally impressive 24 technical papers that have been accepted by the DAC Conference and will be presented in the Engineering Track.

So please make sure to register to attend the conference and join Ansys at DAC. Register for one of our exclusive events or schedule a meeting as we reach out to our customers and partners in advancing the state-of-the-art in Electronic Design Automation.

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