Why AI Chips Made In The U.S. Are Being Sent To Taiwan — Creating A Major Bottleneck

[Daniel Nenni]

There's a new bottleneck in the AI chipmaking process that happens almost entirely in Asia right now: advanced packaging. It connects smaller chips together into a larger chip like a GPU, so it can communicate with data centers and more. As #Nvidia books the majority of capacity, #TSMC prepares to break ground on its first U.S. packaging plants, and #ElonMusk taps Intel for ambitious custom chip plans in Texas. #CNBC got an exclusive interview with TSMC and toured an Intel packaging plant in Arizona to find out exactly how advanced packaging works and why capacity is ramping up fast.