First I want recognize that IEDM once again provided all of the attendees with the proceedings as soon as we arrived at the conference, in fact the proceeding included every year of IEDM back to 1955. This is how a conference should be run! Anyone who read my blog about the SPIE Advanced Lithography Conference will know how frustrating… Read More
Fabless Semiconductor Milestones of 2014!
After working in the semiconductor industry for the past thirty years and writing about it for the past six I would say that 2014 was one of the more interesting years of late. Vindication is the word that pops into my mind now that many “predictions” the fabless detractors have made over the last three years were proven wrong.
As a student… Read More
Results of TSMC’s ECO Fill Flow
By Jeff Wilson, Mentor Graphics and Anderson Chiu, TSMC
At this year’s TSMC Open Innovation Platform® (OIP) Ecosystem Forum, Mentor Graphics and TSMC co-presented some results of the ECO Fill flow developed for TSMC customers working at advanced nodes. Here is a summary of the presentation. (TSMC customers can access the presentation… Read More
IEDM: TSMC, Intel and IBM 14/16nm Processes
This week is IEDM. Three of the presentations today were by TSMC, Intel and IBM going over some of the details of their 14/16nm processes. They don’t provide the slides at IEDM, just the single page papers so this may end up being a somewhat random collection of facts.
TSMC were up first. They talked about the improvements that… Read More
TSMC Gets Ready for IoT
With all the talk about 14/16nm and 10nm it is important to realize that older processes are still important. Eventually 16nm may end up being cheaper than 28nm but for the time being 28nm seems to be a sort of sweet spot, not just cheaper than every process that came before it (which was true for every new node) but also cheaper than every… Read More
TSMC Bringing EUV Into Production
Last week was ASML’s investor day. I wasn’t there and they haven’t yet got the material posted on their website, so this is all second hand information. As you know, if you have read any of my comments on EUV, I have been dubious about whether EUV would ever work for production.
The three big problems seem to be:
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TSMC Sees More Growth in 2015!
As I wait for my plane to Taiwan I’m wondering what the New Year has in store for the fabless semiconductor ecosystem. Good things I hope but to make sure let’s take another look at one of my trusted economic bellwethers (TSMC) which I’m guessing will break the $25B revenue mark this year. That is more than a 25% growth rate year… Read More
What makes the world smart?
The simple answer is when everything in the world is smart. But if you think deeply, you would find that the continuous progression to make things easy in life is what makes the world smarter day-by-day – the sky is the limit. In the world of computing, consider the 17[SUP]th[/SUP] century era when humanbrain was used as a computer … Read More
Intel 2014 Investor Meeting and 14nm Status
Intel’s investor meeting was held yesterday and for me the presentation that is most interesting is Bill Holt’s. The presentations are available on the Intel website: Intel Corporation – Presentations Material 2014. Here is the 2013 version of this presentation: Intel Corporation – Presentations Materials 2013… Read More
Who is REALLY Using TSMC 16FF+?
As I wrote last week there is a whole list of companies on LinkedIn with people working on TSMC 16nm. Today TSMC released a list of customers that have risk production 16FF+ silicon. Most of us knew this already but now we can talk about it in more detail. This is a really big deal for the FinFET doubters out there. Just because Intel had… Read More