If you are building an advanced SoC, you know that you’re going to need a lot of embedded memory. Unless this is your first rodeo, you also know that which memories you choose can have a huge impact on Power, Performance and Area (PPA) and, for some applications, Energy (power integrated over time), Temperature and Reliability. Which… Read More
DOJ takes victory Lap in KLAC / LRCX deal post mortem (3 of 3)
The KLA deal died due to fox guarding the hen house.
Fox can’t guard Hen House…
In an industry where there are relatively few widget makers and only one, very dominant, widget inspector, the thought of one of the widget makers buying the most crucial widget inspector obviously would be anti-competitive. Not only would… Read More
The KLAM deal has died now how will KLAC and LRCX recover? (2 of 3)
As we had been suggesting the merger deal between KLAC and LRCX has failed. It obviously ran into too many complications, costs or other issues to continue. Unlike the Applied TEL deal which went on for a staggering 18 months before calling it quits in this case 12 months was enough to figure out it wasn’t getting done.
In our … Read More
KLAC & LRCX – Fall Out from the deal Falling Apart (1 of 3)
The odds of deal completion has fallen to low levels. Whats the fallout on the companies and stocks? Is there life after a failed merger?
“A quagmire wrapped up inside an enigma” – LRCX & KLAC’s merger is the talk of the town, both in the semiconductor equipment industry as well as DOJ watchers in Washington… Read More
SiFive execs share ideas on their RISC-V strategy
Since its formation just last year, SiFive has been riding the RISC-V rocket from purely academic interest to first commercialization. In an exclusive discussion, I talked with CEO Stefan Dyckerhoff and VP of Product and Business Development Jack Kang about their progress so far and what may be coming next.
Previously, I covered… Read More
16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP
Once a year, during the TSMC’s Open Innovation Platform (OIP) Forum you can expect to see cutting edge technical achievements by TSMC and their partners. This year was no exception, with Open-Silicon presenting its accomplishments in implementing an HBM reference design in 16nm. It’s well understood that HBM offers huge benefits… Read More
eSilicon Revolutionizes Semiconductor IP Selection and Purchasing!
Design starts are the lifeblood of the semiconductor industry which is why we have been following the eSilicon STAR Platform since its introduction with great anticipation. The STAR platform was first launched about three years ago. Today, there are over 1,300 registered STAR users in 52 countries around the world.
The ASIC business… Read More
Shakeup in Analog Rankings
Last week Renesas Electronics announced an agreement to acquire Intersil Corporation for US$3.22 billion. This follows July’s announcement that Analog Devices Inc. (ADI) will acquire Linear Technology Corp. (LTC) for $14.8 billion. These deals will cause a shakeup in the analog IC market. According to IC Insights ranking … Read More
KLAM Kommentary – Assessing the political landscape of approval
LRCX & KLAC’s merger continues to be closely watched given the recent turns and reversals we have seen which call into question the ability to get the deal done. The deal was announced in October of 2015 and we are on our second request from the DOJ and the deal will almost certainly go beyond the Oct 20th, one year deadline… Read More
Is Your Next Reality Going to be Augmented?
John Lennon reportedly once said “Reality leaves a lot to the imagination…” and now we have the technology to do something about making our reality a lot more imaginative. Unless you have been living under a rock (and there is nothing wrong with that – I just haven’t found the right rock myself) there is a LOT going on these days in the… Read More
Huawei’s and SMIC’s Requirement for 5nm Production: Improving Multipatterning Productivity