Despite the strong consolidation in the semiconductor industry, the Design IP market is going well, very well with YoY growth of 13.1% in 2016, according with the Design IP Report from IPnest. ARM Group of Softbank (previously known as ARM Holding) is again the strong #1 with IP revenues (licenses plus royalties) of $1,647 million… Read More
Webinar: Achieving Very High Bandwidth Chip-to-Chip Communication with the Interlaken Interface Protocol
Open Silicon will hold this webinar on June 13th at 8 am PDT (or 5 pm CE) to describe their Interlaken IP core, and how to achieve very high bandwidth C2C communication in various networking applications. To be more specific, the Interlaken protocol can be used to support Packet Processing/NPU, Traffic Management, Switch Fabric,… Read More
Memory drives semiconductor boom in 2017
The semiconductor market was down 0.4% in first quarter 2017 from 4Q 2016 and up 18.1% from a year ago, according to World Semiconductor Trade Statistics (WSTS). The 0.4% decline in 1Q 2017 versus 4Q 2016 is strong compared to an average 4% decline from 4Q to 1Q over the previous five years. The relative strength in 1Q 2017 was driven… Read More
It’s Time to Stop Thinking in Two Dimensions
The first transistor was made of two electrodes, held in place by plastic, making contact with a piece of doped germanium. Ever since then, devices and their packaging have been performing a complicated and oftentimes intricate dance. Single transistor devices became integrated circuits, and along the way separate IC’s were… Read More
SEMICON Southeast Asia reflects strong equipment market
SEMICON Southeast Asia was held this week in Penang, Malaysia. Over 6500 people attended the conference to learn about the latest trends and equipment in semiconductor manufacturing.
Dr. Dan Tracy, Senior Director Industry Research and Statistics at SEMI, presented an optimistic outlook for the semiconductor equipment market… Read More
SPIE 2017 – imec papers and interview
At the SPIE Advanced Lithography Conference imec published a number of papers on EUV, multi-patterning and other lithography issues. In addition to seeing several of the papers presented I had a chance to sit down with imec’s director of advanced patterning, Greg McIntyre. In this article I will summarize my discussions… Read More
1.2 Terabit/s C2C Interface? Only with Interlaken!
If you are familiar with high bandwidth networking applications, you probably know this chip-to-chip (C2C) interface protocol. Interlaken architecture, fully flexible, configurable and scalable, is also an elegant answer to the need for very high bandwidth C2C communication. Interlaken is elegant because the protocol … Read More
IP Vendors: Call for Contribution to the Design IP Report!
The EDA & IP industry enjoys high growth for the Design IP segment, but a detailed analysis tool is missing. IPnest will address this need in 2017, expecting the IP vendors’ contribution! If we consider the results posted last March by the ESD Alliance, the EDA (and IP) industry is doing extremely well, as the global revenue has… Read More
Apple Going (IP) Vertical with no Imagination!
What conclusion could we derive from the recent (April 3) PR from Imagination where we learn that the company “has been notified by Apple Inc. (“Apple”), its largest customer, that Apple is of a view that it will no longer use the Group’s intellectual property in its new products in 15 months to two years time, and as such will not be … Read More
Seven Reasons to Use FPGA Prototyping for ASIC Designs
Using an FPGA to prototype your next hardware design is a familiar concept, extending all the way back to the time that the first FPGAs were being produced by Xilinx and Altera. There are multiple competitors in the marketplace for FPGA prototyping, so I wanted to discern more about what the German-based company PRO DESIGN had to … Read More
Huawei’s and SMIC’s Requirement for 5nm Production: Improving Multipatterning Productivity