Events EDA2025 esig 2024 800X100
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TSMC Doubles Down on Semiconductor Packaging!

TSMC Doubles Down on Semiconductor Packaging!
by Daniel Nenni on 06-14-2023 at 6:00 am

TSMC 3DFabric Integration

Last week TSMC announced the opening of an advanced backend fab for the expansion of the TSMC 3DFabric System Integration Technology. It’s a significant announcement as the chip packaging arms race with Intel and Samsung is heating up.

Fab 6 is TSMC’s first all-in-one advanced packaging and testing fab which is part of the… Read More


VLSI Symposium – Intel PowerVia Technology

VLSI Symposium – Intel PowerVia Technology
by Scotten Jones on 06-12-2023 at 6:00 am

Slide4

At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.

Traditionally all interconnects have taken place on the front side of devices with signal and … Read More


TSMC Clarified CAPEX and Revenue for 2023!

TSMC Clarified CAPEX and Revenue for 2023!
by Daniel Nenni on 06-06-2023 at 2:00 pm

TSMC HQ Taiwan

TSMC clarified CAPEX and revenue for 2023 last night at the Annual Shareholders Meeting. Last year TSMC guided up during this meeting but this year they guided down. CAPEX was guided down to the lower end of $36B-$32B.  Revenue was guided down from low-single to mid-single digit so maybe down another percent or two. The TSMC Jan… Read More


Investing in a sustainable semiconductor future: Materials Matter

Investing in a sustainable semiconductor future: Materials Matter
by Daniel Nenni on 05-31-2023 at 6:00 am

EMD LinkedIn Twitter Materials Matter

In 2020 TSMC established its Net Zero Project with a goal of net zero emissions by 2050. I remember wondering how could this possibly be done before 2050 or at all for that matter. After working with TSMC for 20+ years I have learned never to bet against them on any topic and green manufacturing is one of them, absolutely.

TSMC presented… Read More


Chiplet Interconnect Challenges and Standards

Chiplet Interconnect Challenges and Standards
by Daniel Payne on 05-25-2023 at 10:00 am

Multi die IP min

For decades now I’ve watched the incredible growth of SoCs in terms of die size, transistor count, frequency and complexity. Instead of placing all of the system complexity into a single, monolithic chip, there are now compelling reasons to use a multi-chip approach, like when the maximum die size limit is reached, or it’s… Read More


Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications

Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications
by Daniel Nenni on 05-04-2023 at 6:00 am

Alphawave Semi 3nm Eye Diagram

There were quite a few announcements at the TSMC Technical Symposium last week but the most important, in my opinion, were based on TSMC N3 tape-outs. Not only is N3 the leading 3nm process it is the only one in mass production which is why all of the top tier semiconductor companies are using it. TSMC N3 will be the most successful node… Read More


TSMC 2023 North America Technology Symposium Overview Part 5

TSMC 2023 North America Technology Symposium Overview Part 5
by Daniel Nenni on 04-27-2023 at 10:00 am

Global Footprint

TSMC also covered manufacturing excellence. The TSMC “Trusted Foundry” tagline has many aspects to it, but manufacturing is a critical one. TSMC is the foundry capacity leader but there is a lot more to manufacturing as you will read here. Which brings us to the manufacturing accomplishments from the briefing:

To
Read More

TSMC 2023 North America Technology Symposium Overview Part 4

TSMC 2023 North America Technology Symposium Overview Part 4
by Daniel Nenni on 04-27-2023 at 8:00 am

TSMC Specialty Technology 2023

TSMC covered their specialty technologies in great detail. Specialty is what we inside the ecosystem used to call weird stuff meaning non-mainstream and fairly difficult to do on leading edge processes.  Specialty technologies will play an even more important part of semiconductor design with the advent of chiplets where die… Read More


TSMC 2023 North America Technology Symposium Overview Part 3

TSMC 2023 North America Technology Symposium Overview Part 3
by Daniel Nenni on 04-27-2023 at 6:00 am

3DFabric Technology Portfolio

TSMC’s 3DFabric initiative was a big focus at the symposium, as it should be. I remember when TSMC first went public with CoWos the semiconductor ecosystem, including yours truly, let out a collective sigh wondering why TSMC is venturing into the comparatively low margin world of packaging. Now we know why and it is  absolutely… Read More


TSMC 2023 North America Technology Symposium Overview Part 2

TSMC 2023 North America Technology Symposium Overview Part 2
by Daniel Nenni on 04-26-2023 at 8:00 pm

TSMC N3 Update 2023

The next topic I would like to cover is an update to the TSMC process node roadmap starting with N3. As predicted, N3 will be the most successful node in the TSMC FinFET family. The first version of N3 went into production at the end of last year (Apple) and will roll out with other customers in 2023. There is a reported record amount of … Read More