At the imec technology forum held at SEMICON West, Martin Van Den Brink, President and CTO of ASML presented on the latest developments on EUV. I also had an opportunity to sit down with Mike Lercel, ASML Director of Strategic Marketing for an interview.… Read More
Samsung Sloppy Sailor Spending Spree!
Last week, TEL (which is the Japanese equivalent to AMAT & LRCX) reported a June quarter which saw revenues drop to 236B Yen from March’s 261B Yen and saw earnings drop from March’s 47B Yen to June’s 41B Yen, a respective 9.3% decrease and a 12.8% decrease in earnings.
We don’t think this is attributable… Read More
SEMICON West – Advanced Interconnect Challenges
At SEMICON West I attended the imec technology forum where Zsolt Tokei presented “How to Solve the BEOL RC Dilemma” and the SEMICON Economics of Density Scaling session where Larry Clevenger of IBM presented “Interconnect Scaling Strategic for Advanced Semiconductor Nodes”. I also had the opportunity… Read More
Semicon West – The FDSOI Ecosystem
At Semicon West last week I attended presentations by Soitec and CEA Leti, and had breakfast with CEA Leti CEO Marie Semeria, key members of the Fully Depleted Silicon On Insulator (FDSOI) ecosystem. I have also seen some comments in the SemiWiki forum lately that make me believe there is some confusion on the roles of different companies… Read More
Applying ISO 26262 in a Fabless Ecosystem – DAC Panel Discussion
The fabless movement was instrumental in disaggregating the semiconductor industry. Vertical product development at the chip and system level has given way to a horizontal structure over the years. This organization of product development has been doing an admirable job of delivering extremely reliable products. However… Read More
Standard Node Trend
I have previously published analysis’ converting leading edge logic processes to “standard nodes” and comparing standard nodes by company and time. Recently updated details on the 7nm process node have become available and in this article, I will revisit the standard node calculations and trends.… Read More
Designing at 7nm with ARM, MediaTek, Renesas, Cadence and TSMC
The bleeding edge of SoC design was on full display last month at DAC in Austin as I listened to a panel session where members talked about their specific experiences so far designing with the 7nm process node. Jim Hogan was the moderator and the panel quickly got into what their respective companies are doing with 7nm technology already.… Read More
Exclusive – GLOBALFOUNDRIES discloses 7nm process detail
In a SemiWiki EXCLUSIVE – GLOBALFOUNDRIES has now disclosed the key metrics for their 7nm process. As I previously discussed in my 14nm, 16nm, 10nm and 7nm – What we know now blog GLOBALFOUNDRIES licensed their 14nm process from Samsung and decided to skip 10nm because they thought it would be a short-lived node. At … Read More
LETI Days 2017: FD-SOI, Sensors and Power to Sustain Auto and IoT
I have attended last week to the LETI Days in Grenoble, lasting two days to mark the 50[SUP]th[/SUP] anniversary of the CEA subsidiary. Attending to the LETI Days is always a rich experience: LETI is a research center counting about 3000 research engineers, but LETI is also a start-up nursery. The presentations are ranging from … Read More
3D NAND Myths and Realities
For many year 2D NAND drove lithography for the semiconductor industry with the smallest printed dimensions and yearly shrinks. As 2D NAND shrunk down to the mid-teens nodes, 16nm, 15nm and even 14nm, the cells became so small that there were only a few electrons in each cell and cross-talk issues made further shrinks very difficult… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet