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TSMC’s 5nm 0.021um2 SRAM Cell Using EUV and High Mobility Channel with Write Assist at ISSCC2020

TSMC’s 5nm 0.021um2 SRAM Cell Using EUV and High Mobility Channel with Write Assist at ISSCC2020
by Don Draper on 03-06-2020 at 6:00 am

Fig. 1 Semiconductor Technology Application Evolution

Technological leadership has long been key to TSMC’s success and they are following up their leadership development of 5nm with the world’s smallest SRAM cell at 0.021um 2 with circuit design details of their write assist techniques necessary to achieve the full potential of this revolutionary technology. In addition to their… Read More


GLOBALFOUNDRIES Sets a New Bar for Advanced Non-Volatile Memory Technology

GLOBALFOUNDRIES Sets a New Bar for Advanced Non-Volatile Memory Technology
by Mike Gianfagna on 03-02-2020 at 6:00 am

eNVM applications


Whether it’s the solid-state disk in your laptop, IoT/automotive hardware or  edge-based AI, embedded non-volatile memory (eNVM) is a critical building block for these and many other applications. The workhorse technology for this capability has typically been NOR flash (eFlash), but a problem looms as eFlash presents challenges… Read More


System Level Flows for SoC Architecture Analysis and Design – DVCON 2020

System Level Flows for SoC Architecture Analysis and Design – DVCON 2020
by Daniel Nenni on 02-21-2020 at 6:00 am

CST Header FF SL

As a professional conference attendee I look for the most meaningful way to spend my time and workshops is one of the best. Especially when a customer is involved and there is no bigger EDA customer than Intel, absolutely.

System Level Flows for SoC Architecture Analysis and Design

Speakers:
Swaminathan Ramachandran – … Read More


TSMC Unveils Details of 5nm CMOS Production Technology Platform Featuring EUV and High Mobility Channel FinFETs at IEDM2019

TSMC Unveils Details of 5nm CMOS Production Technology Platform Featuring EUV and High Mobility Channel FinFETs at IEDM2019
by Don Draper on 02-05-2020 at 10:00 am

Diagram of BEOL metallization comparing EUV vs. immersion photolithography

Back in April, 2019, TSMC announced that they were introducing their 5 nm technology in risk production and now at IEDM 2019 they brought forth a detailed description of the process which has passed 1000 hour HTOL and will be in high volume production in 1H 2020.  This 5nm technology is a full node scaling from 7nm using smart scaling… Read More


Intel vs AMD Q4 2019 Conference Calls

Intel vs AMD Q4 2019 Conference Calls
by Daniel Nenni on 02-04-2020 at 6:00 am

Intel 10nm Roadmap

Now that the dust has settled and I’m out of cronovirus quarantine let’s talk about the Intel and AMD conference calls. Unfortunately, the Intel and AMD marketing teams are still outpacing engineering so it is difficult to write something serious but I will do my best.

Spoiler Alert: Both CEOs disappoint.

First an Intel 10nm update:… Read More


WEBINAR: Prototyping With Intel’s New 80M Gate FPGA

WEBINAR: Prototyping With Intel’s New 80M Gate FPGA
by Daniel Nenni on 01-29-2020 at 10:00 am

The next generation FPGAs have been announced, and they are BIG!  Intel is shipping its Stratix 10 GX 10M FPGA, and Xilinx has announced its VU19P FPGA for general availability in the Fall of next year.  The former is expected to support about 80M ASIC gates, and the latter about 50M ASIC gates.  And, to bring this mind-boggling gate… Read More


Specialized Accelerators Needed for Cloud Based ML Training

Specialized Accelerators Needed for Cloud Based ML Training
by Tom Simon on 01-27-2020 at 10:00 am

AI Domain Specific Processor

The use of machine learning (ML) to solve complex problems that could not previously be addressed by traditional computing is expanding at an accelerating rate. Even with advances in neural network design, ML’s efficiency and accuracy are highly dependent on the training process. The methods used for training evolved from CPU… Read More


ASML “A Swing to Memory Looms” Nice performance while awaiting Memory bounce

ASML “A Swing to Memory Looms” Nice performance while awaiting Memory bounce
by Robert Maire on 01-24-2020 at 6:00 am

ASML 2020 Logic Memory
  • Good Q4 & 2019 despite weak memory
  • 2020 will be up year but memory an unknown
  • EUV ramp is on track – no China or memory impact
ASML reports an “in line” Q4 despite industry weak 2019

ASML reported sales of 4B Euros and a nice gross margin of 48% resulting in 2.70 Euros per share in earnings.  Orders came in at 2.4B

Read More

TSMC Q4 2019 “2020 Bellwether” Conference Call Summary

TSMC Q4 2019 “2020 Bellwether” Conference Call Summary
by Daniel Nenni on 01-20-2020 at 6:00 am

TSMC Manufacturing Excellence

After returning from a week in Southern China I found the TSMC Q4 2019 conference call even more interesting. In China they are preparing for the New Year’s Celebration so everything is very festive but what struck me hardest was the massive investment in infrastructure and security. Semiconductors are of course a big part… Read More


The Tech Week that was January 13-17 2020

The Tech Week that was January 13-17 2020
by Mark Dyson on 01-19-2020 at 10:00 am

Semiconductor Weekly Summary 1

In a week where the “phase 1” trade deal between US and China was finally signed, here is all the key news from the semiconductor and technology sector around the world.

After 2 years of an ever increasing trade war, the US and China have signed the so called Phase 1 deal aimed at reducing trade frictions.

Just as important as what is … Read More