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Will the U.S. and China go to War for TSMC?

Will the U.S. and China go to War for TSMC?
by Daniel Nenni on 10-05-2020 at 4:00 am

Will the U.S. and China go to War over TSMC

The semiconductor industry has never been more exciting than it is today and that is a mouthful given what we have accomplished over the last 50 years. From mainframe computers to a supercomputer in our pockets or on our wrists. Even if you don’t believe in miracles, semiconductor technology comes really close, absolutely.

U.S.Read More


5G, Hyperscaling and the Resurgence of Consumer Silicon

5G, Hyperscaling and the Resurgence of Consumer Silicon
by Ramsay Allen on 10-04-2020 at 6:00 am

TSMC 5G OIP 2020

At the recent TSMC OIP Ecosystem Forum and Technology virtual events, TSMC re-affirmed their previous prediction that 5G is going to be a multi-year silicon mega-trend with the biggest drivers being the ramp up of 5G handsets, supporting infrastructure and the continued growth of high performance computing (HPC).

We all want… Read More


SMIC Cut off by US Government is Doomsday Scenario for US Chip Equipment Companies

SMIC Cut off by US Government is Doomsday Scenario for US Chip Equipment Companies
by Robert Maire on 09-27-2020 at 2:00 pm

US versus China Semiconductor

SMIC Cut Off = Worst case scenario
SMIC is on US gov “no fly” list for US Equipment Companies
Will likely lead to loss of all of China- 25% to 50% of revenues
Retaliation by China will worsen situation
SMIC cut off from US technology (Chip Equip)

It has been reported in the Wall St Journal and many news outlets that the US government… Read More


Synopsys talks about their DesignWare USB4 PHY at TSMC’s OIP

Synopsys talks about their DesignWare USB4 PHY at TSMC’s OIP
by Tom Simon on 09-25-2020 at 6:00 am

USB4 operating modes

When USB initially came out it revolutionized how peripherals connect to host systems. We all remember when Apple did away with many separate connections for mouse, keyboard, audio and more with their first computers supporting USB. USB has continued to develop more flexibility and more throughput. In 2015 Apple again introduced… Read More


GLOBALFOUNDRIES Goes Virtual with 2020 Global Technology Conference Series!

GLOBALFOUNDRIES Goes Virtual with 2020 Global Technology Conference Series!
by Daniel Nenni on 09-15-2020 at 10:00 am

GTC 400x400 1

GlobalFoundries is one of the more interesting semiconductor stories of this decade. They started as a spinout of the AMD fabs then acquired Chartered Semiconductor Manufacturing in 2009 and the IBM Microelectronics business in 2014.

Now that events are virtual it is a great time for my fellow semiconductor professionals to

Read More

Highlights of the TSMC Technology Symposium – Part 3

Highlights of the TSMC Technology Symposium – Part 3
by Tom Dillinger on 09-09-2020 at 8:00 am

CoWoS features

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the last of three that attempts to summarize the highlights of the presentations.  This article focuses on the technology design enablement roadmap, as described by Cliff Hou, SVP, R&D.

Key TakeawaysRead More


Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process

Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process
by Mike Gianfagna on 09-07-2020 at 10:00 am

Dolphin Design – Delivering High Performance Audio Processing with TSMCs 22ULL Process

TSMC held their very popular Open Innovation Platform event (OIP) on August 25. The event was virtual of course and was packed with great presentations from TSMC’s vast ecosystem. One very interesting and relevant presentation was from Dolphin Design, discussing the delivery of high-performance audio processing using TSMC’s… Read More


Highlights of the TSMC Technology Symposium – Part 2

Highlights of the TSMC Technology Symposium – Part 2
by Tom Dillinger on 09-07-2020 at 8:00 am

3D Fabric

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the second of three that attempts to summarize the highlights of the presentations.  This article focuses on the TSMC advanced packaging technology roadmap, as described by Doug Yu, VP, R&D.

KeyRead More


In-Chip Monitoring Helps Manage Data Center Power

In-Chip Monitoring Helps Manage Data Center Power
by Tom Simon on 09-07-2020 at 6:00 am

in-chip sensing

Designers spend plenty of time analyzing the effects of process, voltage and temperature. But everyone knows it’s not enough to simply stop there. Operating environments are tough and have lots of limitations, especially when it comes to power consumption and thermal issues. Thermal protection and even over-voltage protections… Read More


Highlights of the TSMC Technology Symposium – Part 1

Highlights of the TSMC Technology Symposium – Part 1
by Tom Dillinger on 09-04-2020 at 8:00 am

A72 core high density

Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time.  This article is the first of three that attempts to summarize the highlights of the presentations.

This article focuses on the TSMC process technology roadmap, as described by the following executives:

  • Y.J. Mii, SVP,
Read More