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WP_Term Object
(
[term_id] => 158
[name] => Foundries
[slug] => semiconductor-manufacturers
[term_group] => 0
[term_taxonomy_id] => 158
[taxonomy] => category
[description] =>
[parent] => 0
[count] => 1263
[filter] => raw
[cat_ID] => 158
[category_count] => 1263
[category_description] =>
[cat_name] => Foundries
[category_nicename] => semiconductor-manufacturers
[category_parent] => 0
[is_post] =>
)
There have been some significant foundry announcements recently that if collated will give you a glimpse into the future of the semiconductor industry. So let me do that for you here.
First the candid EETimes article about TI dumping Samsung as a foundry:
Taiwan’s UMC will take the ”lead role’’ in making the OMAP 5 device on… Read More
Samsung is the #1 electronics company, the #2 semiconductor company, and for 20+ years the world’s largest memory chip maker. Analysts expect Samsung to catch Intel by the year 2014. In the foundry business however Samsung is a distant #9 after more than a five year investment and here’s why:
Foundry 2010 Revenue:
(1) TSMC $13B
(2)… Read More
Although there has been always a strong relationship between ARM and GlobalFoundries, it is interesting to notice that Intel has helped to boost it and make it even stronger. Indeed when AMD renegotiated its x86 licensing deal with Intel in 2009, one of the most significant long-term changes was a marked reduction in how much of … Read More
One of the first things that needs to be created when bringing up a new process is the Process Design Kit, or PDK. Years ago, back when I was running the custom IC business line at Cadence, we had a dominant position with the Virtuoso layout editor and so creating a PDK really meant creating a Virtuoso PDK, and it was a fairly straightforward… Read More
This blog was posted 10 months ago, and the comments have made it much more interesting! Don’t miss the various comments at the back. Also feel free to let us know if you think the status, in this ARM vs Intel “war” has changed a lot since March 2011. Do you really think Intel has catch up with ARM in the mobile industry?… Read More
The semiconductor design and manufacturing challenges at 40nm and 28nm are a direct result ofMoore’s Law, the climbing transistor count and shrinking geometries. It’s a process AND design issue and the interaction is at the transistor level. Transistors may be shrinking, but atoms aren’t. So now it actually matters when even… Read More
The 17[SUP]th[/SUP] Annual TSMC Technology Symposium will be held in San Jose California on April 5[SUP]th[/SUP], 2011. Dr. Morris Chang will again be the keynote speaker. The theme this year is “Trusted Technology and Capacity Provider”and I think it’s important to not only hear what people are saying but also understand why… Read More
Power grids all over the world are already overloaded even without the slew of new electronic gadgets and cars coming out this year. At ISSCC, Dr. Jack Sun, TSMC Vice President of R&D and Chief Technology Officer made the comparison of a human brain to the closest thing available in silicon, a graphical processing unit (GPU).… Read More
I purchased two Toyotas last year and both have since been recalled. Why has Toyota spent $1B+ on recalls in recent years? Same reason why it will cost Intel $700M (which does not include reputation damage) to recall Sandy Bridge chip sets, because someone did not do their job! The WHAT has been discussed, lets talk about HOW it happened.… Read More
For IC designers creating full-custom or AMS designs there are plenty of challenges to getting designs done right on the first spin of silicon. Let me give you a sneak peek into what’s being discussed at the EDA Tech Forum in Santa Clara, CA on March 10th that will be of special interest to you:
3D TSV (Through Silicon Vias) are… Read More
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?