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The adoption of ASML's High-NA EUV lithography tools is being delayed by major chipmakers due to their extremely high cost—about $360–400 million per machine—and uncertain return on investment. TSMC is taking a cautious approach, skipping High-NA for its upcoming 2nm and A16 nodes, instead extending the use of current EUV tools with multiple patterning. Intel, the first major customer to adopt High-NA, has faced significant financial losses in its foundry business, highlighting the risks of early adoption. Samsung has yet to commit to High-NA and may even wait for the next-generation Hyper-NA EUV, expected around 2030, due to reliability and cost concerns. While ASML projects mass production using High-NA EUV by 2026, most foundries are holding off until the technology proves more cost-effective and mature.
