The adoption of ASML's High-NA EUV lithography tools is being delayed by major chipmakers due to their extremely high cost—about $360–400 million per

[Daniel Nenni]

The adoption of ASML's High-NA EUV lithography tools is being delayed by major chipmakers due to their extremely high cost—about $360–400 million per machine—and uncertain return on investment. TSMC is taking a cautious approach, skipping High-NA for its upcoming 2nm and A16 nodes, instead extending the use of current EUV tools with multiple patterning. Intel, the first major customer to adopt High-NA, has faced significant financial losses in its foundry business, highlighting the risks of early adoption. Samsung has yet to commit to High-NA and may even wait for the next-generation Hyper-NA EUV, expected around 2030, due to reliability and cost concerns. While ASML projects mass production using High-NA EUV by 2026, most foundries are holding off until the technology proves more cost-effective and mature.

ASML bets on High-NA EUV as Intel, TSMC, Samsung delay mass adoption over cost and risk

Chiang, Jen-Chieh, Taipei; Sherri Wang, DIGITIMES Asia

www.digitimes.com

 

[siliconbruh999]

Getting the tool for R&D is fine but not for HVM. 14A would most likely be non High-Na if things doesn't work out.

 

[Daniel Nenni]

Getting the tool for R&D is fine but not for HVM. 14A would most likely be non High-Na if things doesn't work out.

I see zero chance for Intel 14A to be HNA-EUV with HVM prior to 2030, as Pat G promised. Maybe they can run some HNA-EUV wafers with limited layers in OR since they already have 2 systems for R&D but not for mass production. Just my opinion of course.

 

[Jure]

ASML is supposedly shipping first EXE:5200 tool to Intel. This would be third high NA tool for Intel, if I didn't mix something up. If true, Intel must be serious about using high NA for 14a.