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An AI assist for 5G enhanced Mobile Broadband for mobile platforms

An AI assist for 5G enhanced Mobile Broadband for mobile platforms
by Bernard Murphy on 02-23-2018 at 7:00 am

If you’re not up-to-speed on 5G, there are three use-cases: eMBB(enhanced mobile broadband) for mobile platforms (Gbps rates, immersive gaming, VR, AR – spectrum usage also extends up to mmWave, but that’s a different topic), mMTCfor massive machine type communication (ultra-low cost, ultra-low power, very dense networks)… Read More


A Development Lifecycle Approach to Security Verification

A Development Lifecycle Approach to Security Verification
by Bernard Murphy on 02-22-2018 at 7:00 am

We have become accustomed to the idea that safety expectations can’t be narrowed down to one thing you do in design. They pervade all aspects of design from overall process through analysis, redundancies in design, fault analytics and mitigation for faults and on-board monitors for reliability among other requirements and techniques.… Read More


Securing embedded SIMs

Securing embedded SIMs
by Bernard Murphy on 02-20-2018 at 6:00 am

If you have a phone, you probably know it has a SIM card, for most of us the anchor that ties us into a 2/3-year plan with one network provider, unless you have an unlocked phone. Even then, you have to mess around swapping SIM cards if you travel overseas. Wouldn’t it be nice if the SIM was embedded and could be switched though an app or an… Read More


Data Security – Why It Might Matter to Design and EDA

Data Security – Why It Might Matter to Design and EDA
by Alex Tan on 02-14-2018 at 12:00 pm


According to the Economist,
The world’s most valuable resource is no longer oil, but data”.
Is this the case?Data is the by-product ofmany aspects of recent technology dynamics and is becoming the currency of today’s digital economy. All categories in Gartner’s Top10 Strategic Technology Trends for 2018 (FigureRead More


High Performance Ecosystem for 14nm-FinFET ASICs with 2.5D Integrated HBM2 Memory

High Performance Ecosystem for 14nm-FinFET ASICs with 2.5D Integrated HBM2 Memory
by Mitch Heins on 02-07-2018 at 10:00 am


High Bandwidth Memory (HBM) systems have been successfully used for some time now in the network switching and high-performance computing (HPC) spaces. Now, adding fuel to the HBM fire, there is another market that shares similar system requirements as HPC and that is Artificial Intelligence (AI), especially AI systems doing… Read More


Increased Processing Power Moves to Edge

Increased Processing Power Moves to Edge
by Tom Simon on 02-06-2018 at 12:00 pm

Recently there has been a lot of buzz about 5G networks. Aside from the talk about it possibly being nationalized, 5G will be a lot different than its predecessors. Rather than a single data link in a predetermined band, 5G will consist of a web of connections all working together to support existing types of data traffic and many new… Read More


CES: An Exhibitor’s Takeaway

CES: An Exhibitor’s Takeaway
by Bernard Murphy on 02-06-2018 at 7:00 am

There are few tech promises these days as prominent as those surrounding driverless cars (trucks, buses, …). But thanks to always-on media amplifiers, it’s not always easy to separate potential from reality. I recently talked to Kurt Shuler, VP Marketing at Arteris, who shared his view after returning from this year’s CES. Kurt… Read More


DSP SoC a la Française

DSP SoC a la Française
by Lauro Rizzatti on 02-04-2018 at 11:00 am

I enjoyed reading Eric Esteve’s article “ French Tech at CES, 2nd country after USA with 274 Start-Up at Eureka Park!” It brought back happy memories of my time at EVE until Synopsys purchased it in 2012.Here is another intriguing story by a French startup named VSORA and founded by Khaled Maalej with a team of scientists and engineers.Read More


Adapting an embedded FPGA for Aerospace Applications

Adapting an embedded FPGA for Aerospace Applications
by Tom Dillinger on 01-30-2018 at 4:00 pm

The IC industry is commonly divided into different market segments – consumer, mobile, industrial, commercial, medical, automotive, and aerospace. A key differentiation among these segments is the characterization and reliability qualification strategy for the fabrication process and design circuitry. For each segment,… Read More


Wanted by January 30th: Paper for DAC IP Track 2018!

Wanted by January 30th: Paper for DAC IP Track 2018!
by Eric Esteve on 01-25-2018 at 12:00 pm

DAC 2018 will take place in San Francisco in June (24 to 28) and you have a fantastic opportunity to present a paper in the IP track! In fact, the deadline has been extended to January 30[SUP]th[/SUP] to submit your proposal.

Let’s make it clear: you are not expected to send the completed paper by this date, just the following:

  • The title
Read More