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Welcome DDR5 and Thanks to Cadence IP and Test Chip

Welcome DDR5 and Thanks to Cadence IP and Test Chip
by Eric Esteve on 05-25-2018 at 7:00 am

Will we see DDR5 memory (device) and memory controller (IP) in the near future? According with Cadence who has released the first test chip in the industry integrating DDR5 memory controller IP, fabricated in TSMC’s 7nm process and achieving a 4400 megatransfers per second (MT/sec) data rate, the answer is clearly YES !

Let’s come… Read More


Worldwide Design IP Revenue Grew 12.4% in 2017

Worldwide Design IP Revenue Grew 12.4% in 2017
by Daniel Nenni on 05-11-2018 at 7:00 am

When starting SemiWiki we focused on three market segments: EDA, IP, and the Foundries. Founding SemiWiki bloggers Daniel Payne and Paul McLellan were popular EDA bloggers with their own sites and I blogged about the foundries so we were able to combine our blogs and hit the ground running. For IP I recruited Dr. Eric Esteve who had… Read More


Tensilica 5th Generation DSP: Mix of Vision and AI

Tensilica 5th Generation DSP: Mix of Vision and AI
by Eric Esteve on 04-17-2018 at 12:00 pm

Cadence has launched the new Tensilica Vision Q6 DSP IP, delivering 1.5x more performance than the former Vision P6 DSP IP and 1.25X better power efficiency. According with Cadence, the mobile industry is moving from traditional feature-based embedded vision to AI-based algorithm, even if all use cases still have mix of vision… Read More


Don’t Stand Between The Anonymous Bug and Tape-Out (Part 2 of 2)

Don’t Stand Between The Anonymous Bug and Tape-Out (Part 2 of 2)
by Alex Tan on 03-16-2018 at 7:00 am


The second panel is about system coverage and big data. Coverage metrics have been used to gauge the quality of verification efforts during development. At system level, there are still no standardized metrics to measure full coverage. The emergence of PSS, better formal verification, enhanced emulation and prototyping techniques… Read More


Don’t Stand Between The Anonymous Bug and Tape-Out (Part 1 of 2)

Don’t Stand Between The Anonymous Bug and Tape-Out (Part 1 of 2)
by Alex Tan on 03-09-2018 at 7:00 am

In the EDA space, nothing seems to be more fragmented in-term of solutions than in the Design Verification (DV) ecosystem. This was my apparent impression from attending the four panel sessions plus numerous paper presentations given during DVCon 2018 held in San Jose. Both key management and technical leads from DV users communityRead More


CES Preview with Cadence!

CES Preview with Cadence!
by Daniel Nenni on 12-18-2017 at 7:00 am

The consumer Electronics Show is in its 50[SUP]th[/SUP] year believe it or not! The first one was in New York (1967) with 250 exhibitors and 17,500 attendees. Portable radios and TVs were all the rage followed by VCRs in 1970 and camcorders and compact discs in 1981. This year there will be 3,900+ exhibits and an estimated 170,000 … Read More


Tensilica Vision P6 DSP is Powering Huawei Kirin 970 Image

Tensilica Vision P6 DSP is Powering Huawei Kirin 970 Image
by Eric Esteve on 11-17-2017 at 7:00 am

Cadence has recently announced two key design-in for their Vision DSP IP family: MediaTek’s Helio P30 integrates the Tensilica Vision P5 DSP and HiSilicon has selected the Cadence® Tensilica® Vision P6 DSP for its 10nm Kirin 970 mobile application processor. The Kirin 970 being integrated into Huawei’s new Mate 10 Series mobile… Read More


ARM and Cadence IP Simplify IoT System Design and Verification

ARM and Cadence IP Simplify IoT System Design and Verification
by Mitch Heins on 08-01-2017 at 7:00 am

As the Internet-of-Things (IoT) markets mature, we are seeing the complexity of IoT systems evolve from simple routing functions that connect IoT edge devices to the cloud into more complex system of systems that manage the interaction between multiple sensor-hubs. IoT sensor-hubs and gateways not only take care of basic care… Read More


Tensilica HiFi 3z DSP Core: Leading Energy Efficiency

Tensilica HiFi 3z DSP Core: Leading Energy Efficiency
by Eric Esteve on 07-28-2017 at 7:00 am

Tensilica HiFi DSP family, dedicated to voice and audio processing, is shipping over 1 billion units worldwide annually, thanks to the 75+ licensees. The new HiFi 3z architecture offers more than 1.3X better voice and audio processing performance than its predecessor, the HiFi 3 DSP, which leads the industry in the number of audio… Read More


Wireless 5G BTS Need Super DSP core… CEVA XC-12

Wireless 5G BTS Need Super DSP core… CEVA XC-12
by Eric Esteve on 03-02-2017 at 10:00 am

Once upon a time, one wireless base station (BTS) was expected to support one, and only one wireless protocol, like GSM (2G), first deployed in Finland in 1991, or CDMAOne (also 2G) developed by Qualcomm and released through the TIA in 1995. Just a precision: the GSM modem speed was reaching 14.4 Kbps (with only 9.6 Kbps usable by end-user)… Read More