The emergence of advanced packaging technologies has led to the introduction of new types of data communication interfaces. There are a number of topologies that are defined by the IEEE 802.3 standard, as well as the Optical Internetworking Common Electrical I/O CEI standard. [1,2] (Many of the configurations of interest … Read More
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. Not all SerDes are the same. The presentation covered here,… Read More
Lip-Bu (Cadence CEO) sure knows how to draw a crowd. For the opening keynote in CadenceLIVE (Americas) this year, he reprised his data-centric revolution pitch, followed by a talk from a VP at AWS on bending the curve in chip development. And that was followed by a talk by a Facebook director of strategy and technology on aspects of… Read More
In all the hubbub about AI/ML, it’s easy to see why visual ML gets more attention. It’s got appeal because of applications such as autonomous driving. Because of this it’s easy to overlook the importance of audio ML. I own a Tesla and putting it into autopilot is very cool, but even it has voice recognition built in as an important feature… Read More
Frequent Semiwiki readers are no doubt familiar with the rapid advances in 2.5D heterogeneous multi-die packaging technology. A relatively well-established product sector utilizing this technology is the 2.5D integration of logic die with a high-bandwidth memory (HBM) DRAM die stack on a silicon interposer; the interposer… Read More
I wrote about Cadence AI IP not long ago when I covered the Cadence Automotive Summit at the end of July (Tensilica DNA 100 Brings the AI Inference Solution for Level 2 ADAS ECUs and Level 4 Autonomous Driving, Tensilica HiFi DSPs for What I Want to Hear, and What I Don’t Want to Hear). One of those two blogs remains one of my most widely … Read More
I recently wrote about Tensilica’s HiFi DSPs which played a significant role at Cadence’s Automotive Design Summit which was held on the Cadence San Jose campus at the end of July. That article focused on infotainment while briefly touching on Advanced Driver-Assistance Systems (ADAS). ADAS is NOT synonymous with autopilot.… Read More
It seems every day we see a new article (or ten) on autonomous driving. It is an especially hot topic, and it will happen someday. For now, we can dream about it, and many people are working on it. But for the present, the technology in a car that commands my attention is audio. I’ve been a musician since 4th grade. I still perform occasionally… Read More
A lot of the attention in intelligent systems is on object detection in still or video images but there’s another very active area, in smart audio. Amazon and Google smart speakers may be the best-known applications but there are more obvious (and perhaps less novelty-driven) applications in enhancing the hearing devices we already… Read More
During the SoC Design Session at the just concluded Linley Spring Processor Conference in Santa Clara, Carlos Macian, Senior Director AI Strategy and Products at eSilicon, held a talk entitled ‘Opposites Attract: Customizing and Standardizing IP Platforms for ASIC Differentiation’.
Standardization is key to IP in modern … Read More
