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It’s popular to use DSP chips for vision processing in diverse applications like ADAS, security cameras and AR. Tensilica has been designing DSP chips and IP since 1997, and their technology was successful enough that Cadence acquired Tensilica back in 2013. At the IP-SoC Silicon Valley 2022 event in April I had the pleasure… Read More
Design IP Sales reached $5.45B in 2021, or 19.4% YoY after 16% in 2020, on-sync with semiconductor growth of 26.2% in 2021 according to WSTS. IPnest has released the “Design IP Report” in May 2022, ranking IP vendors by category (CPU, DSP, GPU & ISP, Wired Interface, SRAM Memory Compiler, Flash Memory Compiler, Library and I/O,… Read More
Ever since the cost of development started growing exponentially, engineering teams have been deploying a shift-left strategy to software development and system verification. While this has helped contain cost and accelerated product development schedules, a shift-left strategy is not without challenges. A virtual platform… Read More
Earbuds are one of the fastest growing market segments, which is creating the need for audio DSPs with higher performance and a smaller energy footprint. More than just being wireless speakers – earbuds, and wearables for that matter, have become a sophisticated extension of the user interface of phones and laptops, etc.… Read More
During his keynote address at the CadenceLIVE 2021 conference, CEO Lip-Bu Tan made some market trend comments. He observed that most of the data nowadays is generated at the edge but only 20% is processed there. He predicted that by 2030, 80% of data is expected to be processed at the edge. And most of this 80% will be processed on edge… Read More
Being engrossed in the digital information world, it is easy to forget that the real world is comprised of mostly analog signals and data. Digital Signal Processors (DSP) take digitized forms of these worldly signals and manipulate them mathematically. Although floating-point is a more relevant and accurate way of representing… Read More
The emergence of advanced packaging technologies has led to the introduction of new types of data communication interfaces. There are a number of topologies that are defined by the IEEE 802.3 standard, as well as the Optical Internetworking Common Electrical I/O CEI standard. [1,2] (Many of the configurations of interest … Read More
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. Not all SerDes are the same. The presentation covered here,… Read More
Lip-Bu (Cadence CEO) sure knows how to draw a crowd. For the opening keynote in CadenceLIVE (Americas) this year, he reprised his data-centric revolution pitch, followed by a talk from a VP at AWS on bending the curve in chip development. And that was followed by a talk by a Facebook director of strategy and technology on aspects of… Read More
In all the hubbub about AI/ML, it’s easy to see why visual ML gets more attention. It’s got appeal because of applications such as autonomous driving. Because of this it’s easy to overlook the importance of audio ML. I own a Tesla and putting it into autopilot is very cool, but even it has voice recognition built in as an important feature… Read More
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