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Perspective in Verification

Perspective in Verification
by Bernard Murphy on 03-07-2017 at 7:00 am

At DVCon I had a chance to discuss PSS and real-life applications with Tom Anderson (product management director at Cadence). Tom is very actively involved in the PSS working group and is now driving the Cadence offering in this area (Perspec System Verifier), so he has a pretty good perspective on the roots, the evolution and practical… Read More


IoT Device Designers Get Help from ARMv8-M Cores

IoT Device Designers Get Help from ARMv8-M Cores
by Mitch Heins on 03-06-2017 at 12:00 pm

Someone once said that IoT devices live in the wild. They must be able to withstand any number of attacks, whether they be communication, physical or software based attacks. The threats are real and the consequences can range from simple irritants to life threatening situations.

It’s because of these threats that IoT device designers… Read More


ESDA Event: Power and Policy in California

ESDA Event: Power and Policy in California
by Bernard Murphy on 03-04-2017 at 7:00 am

Apparently this event is now being postponed until sometime later in the year. Stay tuned

We spend a lot of our time with our heads down in the technical details and when we look up at what we think is the big picture, it’s usually just a little bit bigger, often no more than a justification for immediate product directions. So wouldn’t… Read More


SPIE 2017: EUV Readiness for High Volume Manufacturing

SPIE 2017: EUV Readiness for High Volume Manufacturing
by Scotten Jones on 03-03-2017 at 12:00 pm

The SPIE Advanced Lithography Conference is the world’s leading conference addressing photolithography. This year on the opening day of the conference, Samsung and Intel presented papers summarizing the readiness of EUV for high volume manufacturing (HVM). In this article, I will begin by summarizing the EUV plans … Read More


An Steegen ISS Talk and Interview – Patterning Options for Advanced Nodes

An Steegen ISS Talk and Interview – Patterning Options for Advanced Nodes
by Scotten Jones on 02-28-2017 at 12:00 pm

At the ISS Conference in January, An Steegen EVP of Semiconductor Technology & Systems at imec gave a talk entitled “Patterning Options for Advanced Technology Nodes”. I was present for her talk and had the opportunity to have a follow up interview with An.… Read More


EUV is NOT Ready for 7nm!

EUV is NOT Ready for 7nm!
by Daniel Nenni on 02-27-2017 at 8:00 am

The annual SPIE Advanced Lithography Conference kicked off last night with vendor sponsored networking events and such. SPIE is the international society for optics and photonics but this year SPIE Advanced Lithography is all about the highly anticipated EUV technology. Scotten Jones and I are at SPIE so expect more detailedRead More


Webinar: FPGA Prototyping and ASIC Design

Webinar: FPGA Prototyping and ASIC Design
by Bernard Murphy on 02-26-2017 at 4:00 pm

When you think about working with an ASIC service provider like Open-Silicon, you probably think about handling all the architecture, design and verification/validation in your shop, handing over a netlist and some other collateral, then the ASIC services provider takes responsibility for implementation and manufacturing.… Read More


Another Live Event at Samsung!

Another Live Event at Samsung!
by Daniel Nenni on 02-25-2017 at 7:00 am

Last week Samsung hosted the GSA Silicon Valley “State of the Industry” Meet-up which was well attended by the semiconductor elite, myself included. The agenda started with an update on the semiconductor industry outlook followed by deep dives into Automotive, IoT, Artificial Intelligence, and Cybersecurity all of which areRead More


What You Don’t Know about Parasitic Extraction for IC Design

What You Don’t Know about Parasitic Extraction for IC Design
by Daniel Payne on 02-23-2017 at 7:00 am

Out of college my first job was doing circuit design at the transistor-level with Intel, and to get accurate SPICE netlists for simulation we had to manually count the squares of parasitic interconnect for diffusion, poly-silicon and metal layers. Talk about a burden and chance for mistakes, I’m so thankful that EDA companies… Read More


"Ten-hut!" Attending the Signal Integrity Bootcamp

"Ten-hut!" Attending the Signal Integrity Bootcamp
by Tom Dillinger on 02-21-2017 at 12:00 pm

The engineering team for the design and analysis of a complex system consists of a diverse set of skills — with the increasing emphasis on both high-speed interface design and multi-domain power management, a critical constituent of the team is the group of signal integrity (SI) and power integrity (PI) engineers.

The training… Read More