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WP_Term Object
(
    [term_id] => 50
    [name] => Events
    [slug] => events
    [term_group] => 0
    [term_taxonomy_id] => 50
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 1421
    [filter] => raw
    [cat_ID] => 50
    [category_count] => 1421
    [category_description] => 
    [cat_name] => Events
    [category_nicename] => events
    [category_parent] => 0
    [is_post] => 
)

Next Book Signing: Linley Processor Conference 2016!

Next Book Signing: Linley Processor Conference 2016!
by Daniel Nenni on 09-20-2016 at 12:00 pm

It is a busy month for book signings but it is a pleasure to do it for the greater good of the semiconductor industry. It really is an honor to meet the people who keep our electronic devices on the leading edge of technology, absolutely.

The Linley Processor Conference is on September 27[SUP]th[/SUP]and 28[SUP]th[/SUP] at the Hyatt… Read More


Next SemiWiki Book Signing Event: MIPI DEVCON!

Next SemiWiki Book Signing Event: MIPI DEVCON!
by Daniel Nenni on 08-28-2016 at 12:00 pm

This is the first MIPI DEVCOM event and the location is my favorite, the Computer Museum in Silicon Valley. For those of you who haven’t been, the Computer Museum preserves and presents for posterity the artifacts and stories of the information age, an age we all grew up in. For those of you who have been to the Computer Museum there … Read More


Why are Top Brass from NXP, Qualcomm, Skyworks Keynoting Upcoming IEEE SOI-3D-SubVt (S3S) Conference? (San Francisco, Oct.’16)

Why are Top Brass from NXP, Qualcomm, Skyworks Keynoting Upcoming IEEE SOI-3D-SubVt (S3S) Conference? (San Francisco, Oct.’16)
by Adele Hars on 08-25-2016 at 12:00 pm

By Fred Allibert
The IEEE S3S Conference (10-13 October 2016 at the San Francisco Airport Hyatt Regency) brings together 3 key technologies that will play a major role in tomorrow’s industry: SOI, 3D integration, and Subthreshold Microelectronics. The numerous degrees of freedom they allow enable the ultra-low power operation… Read More


ARM gets wider and more flexible in vectors

ARM gets wider and more flexible in vectors
by Don Dingee on 08-22-2016 at 4:00 pm

ARM has a storied history of announcing major architecture changes at conferences far in advance of product implementations to get their ecosystem moving. At Hot Chips 2016, their sights are set on revamping the ARMv8-A architecture for a new generation of server and high-performance computing parallelism with a preview of … Read More


Semi execs look at IoT tradeoffs a bit differently

Semi execs look at IoT tradeoffs a bit differently
by Don Dingee on 08-15-2016 at 4:00 pm

What happens when you get a panel of four executives together with an industry-leading journalist to discuss tradeoffs in IoT designs? After the obligatory introductions, Ed Sperling took this group into questions on power, performance, and integration.… Read More


Memory War Z: Samsung spins antidote to 3D XPoint

Memory War Z: Samsung spins antidote to 3D XPoint
by Don Dingee on 08-12-2016 at 4:00 pm

The 2016 edition of the Flash Memory Summit produced more than the usual amount of excitement. Samsung’s response to the Intel/Micron 3D XPoint challenge arrived in new slideware, indicating the war for next-generation SSDs is just starting. Who has the advantage?

We’d all like to think this is about creating a breakthrough technology,… Read More


Keynote: Silicon is the New Steel: Building the World’s First Terascale Network

Keynote: Silicon is the New Steel: Building the World’s First Terascale Network
by bkeppens on 08-11-2016 at 12:00 pm

Prof. Thomas Lee from Stanford University is the keynote speaker at the upcoming 38th EOS/ESD Symposium (September 11-16, Anaheim). The EOS/ESD Symposium is focused on discussing the issues and providing the answers to electrostatic discharge in electronic production and assembly.

Abstract:
Steel transformed civilization… Read More


Webinar Alert – Helping Mixed Signal not be Mixed Up

Webinar Alert – Helping Mixed Signal not be Mixed Up
by Don Dingee on 08-10-2016 at 4:00 pm

Today’s profound statement: “don’t fall in love with your tools, figure out the biz process change first.” Mixed-signal SoC designers are having ample challenges with their design process and are in need of design management, but don’t want another tool to do it.… Read More


LTE Trajectory Places High Demands on Baseband Processing

LTE Trajectory Places High Demands on Baseband Processing
by Tom Simon on 08-07-2016 at 7:00 am

LTE stands for Long Term Evolution, and that is exactly what is happening. At the Linley Mobile & Wearables Conference 2016 we received a preview of what is coming in the mobile and wearable markets. LTE is one of the biggest drivers in this entire domain. There was much discussion about the LTE Release 12 and how it increases bandwidth,… Read More


Radio Integration – the Benefits of Built-In

Radio Integration – the Benefits of Built-In
by Bernard Murphy on 08-05-2016 at 7:00 am

It’s always a pleasure when a vendor gives a really informative, vendor-independent presentation on what’s happening in some domain of the industry and wraps up with (by that point) a well-deserved summary of that vendor’ solutions in that space. Ron Lowman did just that at the Linley conference on Mobile and Wearables, where … Read More