Way back when SpringSoft was still SpringSoft and not Synopsys they launched Verdi Interoperability Apps (VIA) and an exchange for users to share them open-source style. I wrote about it back in 2011 when it was announced. Today, Synopsys announced the first developer forum for VIA. It will be held at SNUG on Wednesday, March 26,… Read More
Electronic Design Automation
If requirements ask for it, it had better be there
Engineers are known for their attention to detail and precision in thinking, but sometimes still struggle during compliance audits. This is especially true the longer a list of requirements becomes, especially unstructured lists kept in spreadsheets and on Post-It notes.
It gets even more complicated, because in defense circles… Read More
High Quality PHY IPs Require Careful Management of Design Data and Processes
In last few years IP design has grown significantly compared to the rest of the semiconductor industry. There are newer IP start-ups opening across the world, particularly in India and China. Amid this rush, I wanted to understand the actual dynamics pushing this business and whether all of these IPs follow quality standards. … Read More
CDNLive World Tour
CDNLive is becoming a real worldwide event, starting in March in San Jose and ending in November in Tel Aviv, Israel.
The complete schedule is:
- March 11-12th, Santa Clara, California
- May 19th-21st, Munich, Germany
- July 15th, Seoul, Korea
- August 15th, Shanghai, China
- August 7th, Hsinchu, Taiwan
- August 11-12th, Bangalore, India
TSMC OIP presentations available!
Are you a TSMC customer or partner? If so, you’ll want to take a look at these presentations from the 2013 TSMC Open Innovation Platform conference:
- Design Reliability with Calibre YE-SmartFill and Calibre PERC (Broadcom & Mentor Graphics)
New methodologies were developed for 28nm designs using Calibre SmartFill and Calibre
Simulation of Novel TFT Devices
Traditionally logic devices built on top of thin-film-transistors (TFTs) have used one type of device, either an NMOS a-Si: TFT (hydrogenated amorphous silicon) or a PMOS organic device. Recently a-Si:H and pentacene PMOS TFTs have been integrated into complementary logic structures similar to CMOS. This, in turn, creates… Read More
What will drive MEMS to drive I-o-T and I-o-P?
By I-o-P, I mean Internet-of-People- I couldn’t think of anything better than this to describe a technology which becomes your custodian for everything you do; you may consider it as your good companion through life or an invariably controlling spy. This is obvious with the embedded sensor techno-products such as Kolibree, a … Read More
SPICE Circuit Simulator Gets a Jolt
I’ve been using SPICE circuit simulators since 1978, both internally and commercially developed, and a lot has changed since the early days where netlists were simulated in batch mode on time-share mainframes. We used to wait overnight for our simulations to complete, and in the morning had to pickup our output results … Read More
Stop TDDB from getting through peanut butter
There are a few dozen causes of semiconductor failure. Most can be lumped into one of three categories: material defects, process or workmanship issues, or environmental or operational overstress. Even when all those causes are carefully mitigated, one factor is limiting reliability more as geometries shrink – and it… Read More
Parasitic Debugging in Complex Design – How Easy?
When we talk about parasitic, we talk about post layout design further expanded in terms of electrical components such as resistances and capacitances. In the semiconductor design environment where multiple parts of a design from different sources are assembled together into highly complex, high density SoC, imagine how complex… Read More


Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems