- Taipei 2025/12/04 03:18
Winbond Electronics, a global leader in semiconductor memory solutions, today announced the launch of its new 8Gb DDR4 DRAM, powered by Winbond's advanced 16nm process technology, providing higher speed, lower power consumption, and more cost-effective solutions for diverse markets such as TVs, servers, networking equipment, industrial computers, and embedded applications.
Despite the gradual popularity of DDR5, many industries still rely on the stable and mature ecosystem of DDR4. Winbond's new 8Gb DDR4 DRAM is designed for these DDR4-dependent customers, allowing them to enjoy faster data transfer speeds and stronger system competitiveness while maintaining their existing architecture.
With its advanced 16nm process, Winbond has achieved a significant performance leap in its next-generation DDR4 products. Compared to the previous generation technology, the 16nm node offers smaller die size, higher wafer yield, and better power efficiency, allowing customers to integrate higher capacity DRAM without increasing package size.
At the same time, process optimization also improves signal integrity and reduces leakage rates, ensuring stable operation at data rates of up to 3600Mbps. This combination of high speed, low cost, and high process maturity makes Winbond 16nm DDR4 ideal for long product lifecycle industrial and embedded applications.
The product supports an industry-first 3600Mbps transfer rate, surpassing the existing DDR4 standard to meet the data processing needs of high-speed computing applications. Leveraging Winbond's 16nm technology, the smaller die area provides greater capacity in the same package, further reducing overall system cost.
As a Taiwanese brand, Winbond has complete in-house capabilities from design, 16nm process development to manufacturing, providing a stable supply chain and professional after-sales support for industrial and KGD (Known Good Die) customers.
"DDR4 continues to be an important technology in many markets, and our new 8Gb DDR4 solution enables customers to achieve higher performance and efficiency in mature ecosystems. "Combining the expertise and high-speed characteristics of the 16nm process, Winbond helps customers meet demanding computing needs while reducing total system costs."
Winbond's 16nm process node sets a new benchmark in DDR4 manufacturing maturity, combining speed, scalability, and efficiency, especially for long-life applications. Based on this platform, Winbond is currently developing three products with the same process, including CUBE, 8Gb LPDDR4 and 16Gb DDR4, to further expand its next-generation memory product base.
For more information about Winbond's DDR4 solutions, please visit Winbond
華邦電子推出先進16奈米製程8Gb DDR4 DRAM 專為工業與嵌入式應用而生
全球半導體記憶體解決方案領導廠商華邦電子今日宣布，推出全新8Gb DDR4 DRAM，採用華邦自有先進 16奈米製程技術，提供更高速、更低功耗及更具成本效益的解決方案，適用於電視、伺服器、網通設備、工業電腦及嵌入式應用等多元市場。
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