The use of silicon interposers is growing. Several years ago Xilinx broke new ground by employing interposers in their Virtex®-7 H580T FPGA. Last August Samsung announced what they say is the first DDR4 module to use 3D TSV’s for enterprise servers. Their 64GB double data rate-4 modules will be used for high end computing where … Read More
Electronic Design Automation
A Comprehensive Power Optimization Solution
In an electronic world driven by smaller devices packed with larger functions, power becomes a critical factor to manage. With power consumption leading to heat dissipation issues, reliability of the device can be affected, if not controlled or the device not cooled. Moreover, for mobile devices such as smartphones or tablets… Read More
Networking at 52nd DAC in SFO
Yes, the 52nd DAC(Design Automation Conference) is a technical conference plus exhibition with wonderful keynote speakers and agenda, however there is a certain serendipity that occurs by just meeting people, face to face at the many networking opportunities. The best way to kick off your DAC experience is by attending the Sunday… Read More
Rockchip Bets on Arteris FlexNoC Interconnect IP to Leapfrog SoC Design
China was a virgin territory for Arteris Inc. before July 19, 2012 when Fuzhou Rockchip Electronics announced that it has licensed the Arteris FlexNoC network-on-chip (NoC)-based interconnect IP technology for its multicore SoCs for budget Android tablets. Rockchip mostly targets the tablet and set-top box (STB) markets … Read More
Silvaco: TCAD to Signoff in Vertical Markets
Recently, I talked about meeting with Dave Dutton the CEO of Silvaco. Mainly we were talking about the recent acquisition of Invarian but he also brought me up to date on Silvaco and how he is bringing their disparate product lines into a more focused strategy.
See also Silvaco Swallows Invarian
Silvaco would be the first to admit … Read More
Have We Hit the Power Floor?
As we celebrate the 50[SUP]th[/SUP] anniversary of the publication of Moore’s Law in Electronics Magazine (April 19, 1965), the industry finds itself in an increasingly costly global effort to keep transistor scaling on track. “Is Moore’s Law dead?” is a common question these days.
But practically speaking the doubling of transistor… Read More
Coventor, Lego and IoT in Denmark
Coventor were in Copenhagen Denmark a few weeks ago at the Smart Systems Integration Conference to talk about MEMS and IoT entitled (take a deep breath) Towards a Lego Block Principle for Heterogonous Systems Design Including MEMS and Electronics—Choose and Put Together Fit. Since this seems to have become IoT week for me, without… Read More
Don’t Miss Mentor Graphics U2U San Jose, April 21, 2015
Mentor Graphics’ User2User conference will be held next week on April 21[SUP]st[/SUP] at the San Jose DoubleTree Hotel. This one-day, free conference is the perfect opportunity to learn, network, and share with other Mentor Graphics users.
The day starts off with back-to-back keynotes that examine different aspects of the … Read More
Will your next SoC fail because of power noise integrity in IP blocks?
By the time that your SoC comes back from the fab and you plugin it into a socket on a board for testing, it’s a little late in the cycle to start thinking about reliability concerns like: dynamic voltage drop, noise coupling, EM (Electro-Migration), self-heating, thermal analysis and ESD (Electro-Static Discharge). They… Read More
GPP, GPU or Embedded Vision Dedicated Processor?
Before answering the question we should try to define what is behind “Vision”, which type of applications and evaluate this heterogeneous market weight. Embedded Vision (EV) is the use of computer vision in embedded systems to interpret meaning from image or video. In fact vision processing requires a lot of maths functions that… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet