Wednesday morning I attended a panel discussion with: ARM, IBM, Cadence, GLOBALFOUNDRIES and Samsung.
The panelists all sang the same song of collaboration between EDA, IP and Foundry to enable 28nm, 20nm and even 14nm.… Read More
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Wednesday morning I attended a panel discussion with: ARM, IBM, Cadence, GLOBALFOUNDRIES and Samsung.
The panelists all sang the same song of collaboration between EDA, IP and Foundry to enable 28nm, 20nm and even 14nm.… Read More
Before going to Munich to attend to CDN-Live, I took a look at the agenda to figure out which presentations to attend, and I must say it was not so easy to choose: CDN Live agendais dense, with multiple tracks running in parallel (Custom Design, Digital Implementations, Design IP, Functional Verifications and Verification IP, PCB… Read More
Yesterday’s SEMICO IP Ecosystem Conference was well worth the time. Everybody was there: ARM, Synopsys, Cadence, Mentor Graphics, GlobalFoundries, TSMC, MIPS, Tensilica, AMD, Atrenta, Sonics, and Tabula, everybody except Intel of course. What do Intel and I have in common? We don’t play well with others…
First up was… Read More
What’s new at Cadence? Quite a bit actually. I have always been a Cadence fan, I mean really, they gave birth to modern EDA. Unfortunately, Cadence really lost me during the Avant! legal action, the Mike Fister years, and EDA360. Recently, however, Cadence has made some big changes that will definitely get them back on my good side.… Read More
We are all aware that at 28nm and below several types of complex layout effects manifest themselves into the design and pose a herculean task, with several re-spins to correct them at pre-tapeout. It’s apparent that the layout needs to be correct by construction at the very beginning during the design stage.
Collaboration between EDA, Foundry and Design was the key idea today in a webinar hosted by IBM and Cadence about 20nm custom IC design. The three presenters were:
John Stabenow, Cadence
Jeremiah Cessna, Cadence
Keith Barkley, IBM… Read More
At the GSA 3D IC working group meeting, Cadence presented their perspective on 3D ICs. Their view will turn out to be important since the new chair of the 3D IC working group is going to be Ken Potts of Cadence. Once GSA decided the position could not be funded then an independent consultant like Herb Reiter had to bow out and the position… Read More
If you are in Europe then the CDNLive! EMEA user conference is in Munich at the Dolce Hotel from May 14th to 16th. Like last month’s CDNLive! in Cadence’s hometown San Jose, the conference focuses on sharing fresh ideas and best practices for all aspects of semiconductor design from embedded software down to bare silicon.… Read More
Recently I was researching the keynote speeches of isQED (International Society for Quality Electronic Design) Symposium 2012 and saw the very first, great presentation, “Taming the Challenges in Advanced Node Design” by Tom Beckley, Sr. VP at Cadence. I know Tom very well as I have worked with him and I admire his knowledge, authority… Read More
Lip-Bu Tan, the CEO of Cadence, has been named by the Singapore Business Awards as Outstanding CEO (overseas) last week. These awards were launched in 1985 by the Business Times and DHL, so this year is the 27th year of the award, created to recognize business leaders in Singapore and abroad.
As it happens, Cadence flew me first class… Read More
Podcast EP16: Hyperscale Computing & Changes in the Datacenter
Podcast EP90: A Tour of Cadence’s Cloud Solutions with Mahesh Turaga
Podcast EP105: Cadence STA Strategy and Capabilities, Today and Tomorrow with Brandon Bautz
Podcast EP112: How Cadence is Revolutionizing Full-Chip Signoff with Certus
Podcast EP255: The Growing Proliferation of Semiconductors and AI in Cars with Amol Borkar
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