Dan is joined by David French, CEO of SigmaSense. David is best known for his 20-year focus on digital signal processors at Texas Instruments, and Analog Devices. In addition, he spearheaded the transition of Cirrus Logic’s business as its CEO, from a supplier of logic chips into personal computers to become a profitable… Read More
Synopsys recently presented a webinar on using their own software to optimize one of their own IPs (an ARC HS68 processor) for both performance and power through what looks like a straightforward flow from initial configuration through first level optimization to more comprehensive AI-driven PPA optimization. Also of note … Read More
I confess I am reading tea leaves in this blog, but why not? Arm recently announced Arm Total Design, an expansion of their Compute Subsystems (CSS) offering which made me wonder about the motivation behind this direction. They have a lot of blue-chip partners lined up for this program yet only a general pointer to multi-die systems… Read More
I’m a fan of DVCon, a fan of Accellera and a fan of Munich, hosting DVCon Europe once again. This year’s event runs from November 14th through 15th (with some events on the 16th) at the Holiday Inn Munich in the City Center. Phillippe Notton (CEO, SiPearl) will deliver a keynote on “Energy Efficient High-Performance Computing in the… Read More
In today’s fast-paced world, innovation in semiconductor design is a constant demand. The need for quicker, more accurate, and innovative solutions has paved the way for exploring the potential of Generative AI (#GenerativeAI) in the realm of semiconductor design development. Can it be done? Hell yeah! In this article… Read More
Regardless of where you grew up you probably know the story of Alice in Wonderland. The story is over 100 years old, but holds up to the present day, thanks in part to some magic from Disney. It evokes visions of a place that elicits admiration and wonder, to create a place of magical charm. In the context of AI, it takes on a more relevant… Read More
Synopsys recently hosted a cross-industry panel on the state of multi-die systems which I found interesting not least for its relevance to the rapid acceleration in AI-centric hardware. More on that below. Panelists, all with significant roles in multi-die systems, were Shekhar Kapoor (Senior Director of Product Management,… Read More
Two recent software-based algorithmic technologies –– autonomous driving (ADAS/AD) and generative AI (GenAI) –– are keeping the semiconductor engineering community up at night.
While ADAS at Level 2 and Level 3 are on track, AD at Levels 4 and 5 are far from reality, causing a drop in venture capital enthusiasm and money. Today,… Read More
As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
Verification IP proves essential for PCIe GEN5