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The difficulty of managing the power domains on a complex SoC led to the development of a power format file description, to serve as the repository for data needed for functional and electrical analysis (e.g., CPF, UPF). Yet, what about complex printed circuit boards? How can the power domain information be effectively represented… Read More
Last month, I made a “no-brainer” forecast that 2017 would be the year in which embedded FPGA (eFPGA) IP would emerge as a key differentiator for new SoC designs (link to the earlier article here).
The fusion of several technical and market factors are motivating design teams to incorporate programmable logic functionality… Read More
The engineering team for the design and analysis of a complex system consists of a diverse set of skills — with the increasing emphasis on both high-speed interface design and multi-domain power management, a critical constituent of the team is the group of signal integrity (SI) and power integrity (PI) engineers.
The training… Read More
One of the greatest hockey players of all time, Wayne Gretzky, provided a quote that has also been applied to the business world — “I skate to where the puck will be, not to where it has been.” It strikes me that this philosophy directly applies to IP development, as well. Engineering firms providing IP must anticipate… Read More
The start of the new year is typically a time for annual predictions. Prognostications are especially difficult in our industry, due to the increasing difficulty in Moore’s Law technology scaling and greater design complexity challenges. There is one sure prediction, however — this year will see the emergence … Read More
The world-renowned statistician, Professor George Box, said, “Essentially, all models are wrong, but some are useful.” — that quote was the theme for one of the technical talks at the recent MOS-AK Workshop, held at UC-Berkeley. … Read More
Photonics IC’s (PIC’s) are used to transmit and receive data through a (single-mode or multi-mode) optical fiber carrier, and provide the requisite electro-optical conversion for system integration. The architecture of the PIC spans the full characteristics of data transmission and reception:
Typically,… Read More
Printed circuit boards that incorporate a combination of traditional PCB technology with flexible substrates, aka rigid-flex designs, have enabled an increasing variety of product designs, that leverage the unique physical form factor and lightweight options that rigid-flex technology offers. Yet, this technology requires… Read More
Recently, TSMC conducted their annual Open Innovation Platform forum meeting in San Jose. Although TSMC typically eschews a theme for the forum, David Keller, EVT TSMC North America, used a phrase in his opening remarks that served as a foundation for the rest of the meeting – “celebrate the way we collaborate”.
The forum begins… Read More
Electronic system level (ESL) modeling for system architecture exploration is rapidly gaining momentum. The simulation performance requirements for hardware/software co-design are demanding — an abstract model for SoC IP cores is required. Typically, soft IP will include a number of model configuration parameters.… Read More
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