Embedded FPGA Blocks as Functional Accelerators (AMBA Architecture, with FREE Verilog Examples!)

Embedded FPGA Blocks as Functional Accelerators (AMBA Architecture, with FREE Verilog Examples!)
by Tom Dillinger on 07-20-2017 at 7:00 am

A key application for embedded FPGA (eFPGA) technology is to provide functionality for specific algorithms — as the throughput of this implementation exceeds the equivalent code executing on a processor core, these SoC blocks are often referred to as accelerators. The programmability of eFPGA technology offers additional… Read More


System Implementation Connectivity Verification and Analysis, Including Advanced Package Designs

System Implementation Connectivity Verification and Analysis, Including Advanced Package Designs
by Tom Dillinger on 06-08-2017 at 4:00 pm

Regular Semiwiki readers are aware of the rapid emergence of various (multi-die) advanced package technologies, such as: FOWLP (e.g., Amkor’s SWIFT, TSMC’s InFO); 2D die placement on a rigid substrate (e.g., TSMC’s CoWoS); and, 2.5D “stacked die” with vertical vias (e.g., any of the High Bandwidth Memory,… Read More


Tools for Advanced Packaging Design Follow Moore’s Law, Too!

Tools for Advanced Packaging Design Follow Moore’s Law, Too!
by Tom Dillinger on 06-05-2017 at 9:00 am

There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More


Embedded FPGA IP update — 2nd generation architecture, TSMC 16FFC, and a growing customer base

Embedded FPGA IP update — 2nd generation architecture, TSMC 16FFC, and a growing customer base
by Tom Dillinger on 05-31-2017 at 12:00 pm

Regular Semiwiki readers are aware that embedded FPGA (eFPGA) IP development is a rapidly growing (and evolving) technical area. The applications for customizable and upgradeable logic in the field are many and diverse — as a result, improved performance, greater configurable logic capacity/density, and comprehensive… Read More


3D Product Design Collaboration in MCAD and ECAD Platforms

3D Product Design Collaboration in MCAD and ECAD Platforms
by Tom Dillinger on 04-25-2017 at 12:00 pm

Consumer electronics demand aggressive mechanical enclosure design — product volume, weight, shape, and connector access are all critical design optimization criteria. Mechanical CAD (MCAD) software platforms are used by product engineers to develop the enclosure definition — the integration of the PCB design… Read More


Top 10 Updates from the TSMC Technology Symposium, Part I

Top 10 Updates from the TSMC Technology Symposium, Part I
by Tom Dillinger on 03-22-2017 at 7:00 am

Last week, TSMC held their 23rd annual technical symposium in Santa Clara. In the Fall, TSMC conducts the OIP updates from EDA/IP partners and customers. The theme of the Spring symposium is solely on TSMC’s technology development status and the future roadmap. Indirectly, the presentations also provide insight into … Read More


What’s better than silicon-proven IP? Lab bench-proven!

What’s better than silicon-proven IP? Lab bench-proven!
by Tom Dillinger on 03-17-2017 at 12:00 pm

The SoC industry depends upon the availability of validated IP. SoC designs require a huge investment, and assume the external IP that is licensed from outside parties satisfies all functional and electrical specifications. To support that requirement, IP providers typically pursue a strategy to demonstrate their designs… Read More