Frequent Semiwiki readers are no doubt familiar with the rapid advances in 2.5D heterogeneous multi-die packaging technology. A relatively well-established product sector utilizing this technology is the 2.5D integration of logic die with a high-bandwidth memory (HBM) DRAM die stack on a silicon interposer; the interposer… Read More
The concept of applying useful clock skew to the design of synchronous systems is not new. To date, the application of this design technique has been somewhat limited, as the related methodologies have been rather ad hoc, to be discussed shortly. More recently, the ability to leverage useful skew has seen a major improvement,… Read More
The market opportunities for machine learning hardware are becoming more succinct, with the following (rather broad) categories emerging:
- Model training: models are evaluated at the “hyperscale” data center; utilizing either general purpose processors or specialized hardware, with typical numeric precision of 32-bit
Advanced packaging technology is enabling “More Than Moore” scaling of heterogeneous technology die. At the recent EDPS Symposium in Milpitas, Craig Hillman, Director of Product Development, DfR Solutions, at ANSYS gave a compelling presentation, “Reliability Challenges in Advanced Packaging”. The key takeaway messages… Read More
The introduction of 5G communications support offers tremendous potential across a broad spectrum of applications (no pun intended). 5G is indeed quite encompassing, across a wide range of frequencies – the figure below illustrates the common terminology used, from low-band, mid-band (“sub 6G”), and high-band (“mmWave… Read More
A new designation has recently entered the vernacular of the computing industry – a hyperscale data center. The adjective hyperscale implies the ability of a computing resource to scale corresponding to increased workload, to maintain an appropriate quality of service.
The traditional enterprise data center is often characterized… Read More
In the old days, product architects would throw a functional block diagram “over the wall” to the design team, who would plan the physical implementation, analyze the timing of estimated critical paths, and forecast the signal switching activity on representative benchmarks. A common reply back to the architects was, “We’… Read More
Daniel Nenni was gracious enough to encourage me to conduct a brief webinar describing a new reference text, recently published by Prentice-Hall, part of the Semiwiki Webinar Series.
I was motivated to write the text to provide college students with a broad background… Read More
The pace of Moore’s Law scaling for monolithic integrated circuit density has abated, due to a combination of fundamental technical challenges and financial considerations. Yet, from an architectural perspective, the diversity in end product requirements continues to grow. New heterogeneous processing units are being… Read More
The emergence of 3D packaging technology has been accompanied by the term “more than Moore”, to reflect the increase in areal circuit density at a rate that exceeds the traditional IC scaling pace associated with Moore’s Law. At the recent Design Automation Conference in Las Vegas, numerous exhibits on the vendor floor presented… Read More