Intel recently provided a detailed silicon process and advanced packaging technology roadmap presentation, entitled “Intel Accelerated”. The roadmap timeline extended out to 2024, with discussions of Intel client, data center, and GPU product releases, and especially, the underlying technologies to be … Read More
Traditionally, the interface between chip designers and system power, packaging, reliability, and mechanical engineering teams was a relatively straightforward exchange of specifications. Chip designers developed preliminary power dissipation estimates, often based on a simplifying power/mm**2 value. … Read More
Previous SemiWiki articles have discussed the introduction of embedded Spin-Transfer Torque Magnetoresistive RAM IP from GLOBALFOUNDRIES, as an evolution replacement for non-volatile embedded flash memory. (link, link)
Those articles described the key features of STT-MRAM technology, but didn’t delve into a key reliability… Read More
The emergence of 2.5D heterogeneous die integration using a silicon (or organic) interposer has enabled unique system architectures. The term “More than Moore” has been used to describe the circuit density and cost advantages of leveraging multiple die in the package, the die potentially in different process technologies. … Read More
The annual VLSI Symposium provides unique insights into R&D innovations in both circuits and technology. Indeed, the papers presented are divided into two main tracks – Circuits and Technology. In addition, the symposium offers workshops, forums, and short courses, providing a breadth of additional information.
At… Read More
The successful transition to a new fabrication process from development to high volume manufacturing requires a collective, collaborative effort among process engineers, equipment manufacturers, and especially, chemical suppliers. Of particular importance is the chemistry of the photoresist materials and their interaction… Read More
At the recent TSMC Technology Symposium, TSMC provided a detailed discussion of their development roadmaps. Previous articles have reviewed the highlights of silicon process and packaging technologies. The automotive platform received considerable emphasis at the Symposium – this article specifically focuses on the… Read More
The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings.
Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric.
2.5D package technology – CoWoS
The 2.5D packaging options are divided into the CoWoS… Read More
Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap. This article will review the highlights of the silicon process developments and future release plans.
Subsequent articles will describe the packaging offerings and delve into technology … Read More
Machine learning applications have become pervasive and increasingly complex, from recommendation agents in online interactions to personal assistants for command response to (ultimately) autonomous vehicle control. Yet, an often overlooked facet of machine learning technology is the deployment in industrial process… Read More